Microdevice Transfer Anchors for Backplane Integration Stability

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Solution Overview

Problem

Existing methods for integrating micro devices onto system substrates face challenges in efficiently transferring and securing them without damaging the devices or compromising their functionality.

Innovation Solution

A method involving forming a micro device on a first substrate, covering it with a dielectric layer, adding a release layer, bonding it to a second substrate via a conductive layer, removing the first substrate, patterning the dielectric layer to form anchors, and transferring it to a system substrate while creating a void around the micro device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If micro devices are transferred from a first substrate to a system substrate, then integration efficiency is improved, but device integrity and functionality may be compromised during transfer

Engineering Contradiction:

Improveintegration efficiencyVSAvoiddevice integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The dielectric layer is patterned to form anchors before the micro device is transferred to the system substrate. These pre-formed anchors are positioned to receive and secure the micro device during transfer, ensuring device integrity is maintained from the outset of the transfer process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The dielectric layer with patterned anchors acts as an intermediary structure between the first substrate and the system substrate. The anchors provide a secure interface that holds the micro device during transfer, protecting it from damage while enabling efficient integration onto the system substrate

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of operation

If a release layer is removed to create a void around the micro device, then transferability is improved, but device stability may be compromised

Engineering Contradiction:

ImprovetransferabilityVSAvoiddevice stability

Core Design Contradiction:

Ease of operationVSStability of the object's composition

Solution Approach 1:

The anchors are formed in the dielectric layer before the release layer is removed and before the micro device is transferred. This preliminary formation of anchors ensures that when the release layer is removed and the device becomes unstable, the anchors are already in position to immediately secure the device during transfer

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patterned anchors in the dielectric layer provide a cushioning or support structure that compensates for the instability created by removing the release layer. The anchors are positioned to receive and stabilize the micro device at the moment of transfer, preventing damage despite the temporary instability

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS12477862B2Cartridge inspection anchors

Publication Date: 2025.11.18 VUEREAL INC

AI summary

The present disclosure deals with a method of integrating microdevices on a backplane using bonded pads. The process has a substrate having microdevices with bonding of selective microdevices through connecting pads on the microdevices and corresponding pads on the backplane, forming anchors and leaving the bonded selective set of microdevices on the backplane by separating the micro device substrate.