Microdevice Transfer Anchors for Precise Substrate Release
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Solution Overview
Problem
Existing methods for integrating and transferring microdevices to a substrate face challenges in securely anchoring and efficiently transferring microdevices without defects or misalignment.
Innovation Solution
The method involves forming diaphragm layers on a substrate, bonding microdevices to these diaphragm structures with a bonding layer, and using anchors to securely hold the microdevices in place during transfer. This process includes inspecting substrates for defects, identifying good areas for transfer, and using release layers to facilitate the separation of microdevices from their original substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If microdevices are transferred from donor substrate to cartridge substrate, then productivity is improved through parallel processing, but manufacturing precision deteriorates due to alignment challenges between substrates
Solution Approach 1:
The patent introduces a release layer as an intermediary between the microdevice and the donor substrate. This release layer enables controlled detachment of microdevices during transfer, facilitating parallel processing while maintaining positioning accuracy through the intermediary's controlled release properties
Solution Approach 2:
The patent applies preliminary action by pre-forming anchors on the cartridge substrate before microdevice transfer. These anchors are positioned in advance to receive and secure microdevices, ensuring alignment precision is maintained during the high-speed parallel transfer process
2Reliability
If anchors are integrated to securely hold microdevices, then reliability is improved through secure anchoring, but device complexity increases due to additional anchor structures and processes
Solution Approach 1:
The patent merges the anchor structure with the cartridge substrate by forming anchors as integral parts of the substrate structure rather than as separate components. This combining approach ensures reliable anchoring while reducing overall device complexity by eliminating the need for separate anchor components
Solution Approach 2:
The patent applies segmentation by creating multiple discrete anchor regions on the cartridge substrate, each corresponding to specific microdevice placement zones. This segmented approach provides secure anchoring at needed locations while leaving other areas of the substrate simple and uncluttered
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively integrates and transfers microdevices with high precision and accuracy, ensuring secure anchoring and efficient transfer while minimizing defects and misalignment.
Implementation Method 1
the release layer is delaminated by either chemical, laser, thermal or a mechanical process
Implementation Method 2
the release layer is delaminated by either chemical, laser, thermal or a mechanical process
Implementation Method 3
the release layer is delaminated by either chemical, laser, thermal or a mechanical process
Implementation Method 4
the release layer is delaminated by either chemical, laser, thermal or a mechanical process
Implementation Method 5
bonding the microdevice surface to the diaphragm structures with a bonding layer
Data Source
AI summary
The present disclosure relates to development of microdevices on a substrate that can be released and transferred to a system substrate. The disclosure further relates to methods to integrate anchors to hold a microdevice to a substrate. The microdevices are in different configurations with respect to anchors, release layers, buffers layers and substrate.