Microdevice Transfer Bonding Using Temporary Conductive Anchors

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Solution Overview

Problem

Current methods for integrating optoelectronic microdevices into system substrates face challenges in achieving enhanced bonding and conductivity, particularly in transferring microdevices from a donor substrate to a system substrate while ensuring reliable attachment and minimizing damage to the microdevices.

Innovation Solution

A method involving the use of temporary conductive materials to redirect current and serve as anchors, allowing for secure holding of microdevices on the donor substrate and subsequent transfer to a system substrate with improved bonding and conductivity capabilities, using techniques such as thermal transfer and breakable anchors to facilitate the process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If microdevices are transferred from donor substrate to system substrate, then integration capability is improved, but bonding reliability deteriorates

Engineering Contradiction:

Improveintegration capabilityVSAvoidbonding reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent introduces temporary conductive material as an intermediary element between the microdevice and the system substrate. This temporary material serves as a mediator that enables reliable bonding during the transfer process, resolving the contradiction between integration capability and bonding reliability by providing a transitional bonding interface that can be removed after successful integration.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent applies preliminary action by pre-depositing temporary conductive material on the donor substrate before the transfer process. This preliminary preparation ensures that bonding reliability is established in advance, allowing for successful transfer while maintaining integration flexibility.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If temporary conductive material is used to redirect current, then conductivity is improved, but manufacturing complexity increases

Engineering Contradiction:

ImproveconductivityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs the discarding and recovering principle by using temporary conductive material that is discarded after serving its purpose. The temporary material provides necessary conductivity during the transfer and bonding process, then is removed once the microdevice is successfully integrated, thereby improving conductivity without permanently increasing device complexity.

Inventive Principle:

Principle #34Discarding and recovering

Solution Approach 2:

The temporary conductive material functions as a disposable element that is introduced for a specific purpose during manufacturing and then removed. This approach improves conductivity during the critical transfer phase without creating permanent complexity in the final device structure.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Stability of the object's composition

If microdevices are held on donor substrate using anchors, then positioning stability is improved, but transfer difficulty increases

Engineering Contradiction:

Improvepositioning stabilityVSAvoidtransfer difficulty

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent uses preliminary action by pre-forming breakable anchors on the donor substrate before placing the microdevices. These anchors provide positioning stability during storage and handling, and are designed to be broken during the transfer process, thereby resolving the contradiction between stability and transfer ease through staged functionality.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The anchor structure is segmented into a stable holding portion and a breakable release portion. This segmentation allows the anchor to provide stable positioning during non-transfer phases while enabling easy release during transfer, effectively resolving the contradiction between positioning stability and transfer difficulty.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables reliable transfer and bonding of microdevices with enhanced conductivity and reduced risk of damage, ensuring stable integration and efficient electrical connections on the system substrate.

Implementation Method 1

temporary conductive materials to redirect current and serve as anchors

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

using techniques such as thermal transfer and breakable anchors to facilitate the process

Methodology Applied

Scientific EffectThermal transfer: Conduction (thermal)

Data Source

PatentUS12080685B2Method of placing a micro device to a receiver substrate

Publication Date: 2024.09.03 VUEREAL INC

AI summary

In a micro-device integration process, a donor substrate is provided on which to conduct the initial manufacturing and pixelation steps to define the micro devices, including functional, e.g. light emitting layers, sandwiched between top and bottom conductive layers. The microdevices are then transferred to a system substrate for finalizing and electronic control integration. The transfer may be facilitated by various means, including providing a continuous light emitting functional layer, breakable anchors on the donor substrates, temporary intermediate substrates enabling a thermal transfer technique, or temporary intermediate substrates with a breakable substrate bonding layer.