Microdisplay Adhesive Bonding via UV Crosslinking and Release Agent

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Solution Overview

Problem

Existing methods for fabricating microdisplay devices with protective sheets struggle to accurately apply adhesive to the active zone without covering electrical contacts, leading to imperfect protection and complex contact liberation processes.

Innovation Solution

Applying a crosslinkable adhesive over the entire surface of the microdisplay or protective sheet, with an organic protective layer on the connection zone that is permeable to electromagnetic radiation, allowing for easy removal and protection of electrical contacts during assembly and subsequent access.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive is applied over the entire surface of the microdisplay or protective sheet, then the microdisplay is fully protected by the sheet, but the electrical contacts of the connection zone are covered with cured adhesive, complicating subsequent contact liberation

Engineering Contradiction:
Improveprotection of microdisplayVSAvoidliberation of electrical contacts
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The connection zone is segmented from the active zone by defining a specific separation line, and the protective sheet is structured with cavities that align with electrical contacts to create isolated contact regions. This segmentation allows the adhesive to be applied universally while maintaining accessible contact zones through the cavity structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A release agent is introduced as an intermediary substance applied to the connection zone before adhesive application. This release agent prevents adhesive from bonding to the electrical contacts during the bonding process, allowing contacts to be liberated easily after curing by removing the release agent, while still maintaining full protection of the microdisplay.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If adhesive is applied in the form of a bead surrounding the active zone, then electrical contacts are preserved, but the microdisplay is imperfectly protected by the sheet

Engineering Contradiction:
Improvepreservation of electrical contactsVSAvoidprotection of microdisplay
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The protective sheet is segmented into regions with cavities that align with electrical contacts, creating dedicated contact access zones. This segmentation allows universal adhesive application while maintaining contact accessibility through the structured cavity design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The protective sheet structure serves multiple functions simultaneously: it provides universal protection across the entire microdisplay surface while also creating structured access paths to electrical contacts through cavities. The same sheet structure achieves both protection and contact accessibility without requiring separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If the protective sheet is prestructured to form cavities for electrical contacts, then contact liberation is facilitated, but an additional prior structuring step is required

Engineering Contradiction:
Improveliberation of electrical contactsVSAvoidfabrication process steps
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

A release agent is applied preliminarily to the connection zone before adhesive application. This preliminary action prevents adhesive bonding to contacts in advance, eliminating the need for complex post-bonding contact liberation steps. The release agent is subsequently removed easily after curing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The complexity of structuring cavities is extracted from the protective sheet fabrication process and replaced by a simpler chemical approach using a release agent. The release agent temporarily modifies the surface properties of the connection zone to prevent adhesive bonding, and is then extracted or removed, achieving contact accessibility without complex structural modifications to the sheet.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective protection of electrical contacts and easy liberation of the connection zone, allowing for precise application of adhesive over the entire surface without requiring additional structuring steps, while maintaining the integrity of the microdisplay.

Implementation Method 1

crosslinking the adhesive by UV radiation through the sheet thus assembled

Methodology Applied
Scientific EffectUV crosslinking: Photopolymerisation

Data Source

PatentUS8975815B2Method for making an electronic display device covered by a protection plate
Publication Date: 2015.03.10 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • US8975815B2 patent drawing
  • US8975815B2 patent drawing
  • US8975815B2 patent drawing

AI summary

The invention relates to a method for making an electronic display device (1) having a screen (3) covered by a protection plate, and to a substrate (2) covered by said screen for obtaining such a device. The method comprises the following steps: a) applying glue (10) at the non cross-linked state substantially on the entire surface of the screen and/or the assembling surface (11a) of the plate (11) following a deposit on the screen connection area (5) of at least one organic layer (15) for protecting the connection area from the glue; applying the assembling surface against the screen via the glue; c) emitting a radiation through the plate for cross-linking the glue; and d) removing a portion of the plate covering the connection area so that the latter can be electrically accessible, the protection layer being removed from the connection area upon said removal or during a further surface processing step. According to the invention, the protection layer contains at least one organic compound selected from the group comprising compounds derived from diamines and organometallic complexes with heterocycles.