Microdisplay Module Back-Surface Connector Routing
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Solution Overview
Problem
Conventional microdisplay module designs with flexible circuit connectors extending from the front surface occupy excessive space, leading to potential component failures and assembly complications in small-scale display systems due to limited internal space.
Innovation Solution
A low-profile microdisplay module design where the flexible circuit connector is connected to the back surface of the package substrate, reducing the required surface area and overall size by routing metal vias through the substrate from the front to the back surface, allowing the flex circuit to be curled around the edge, thereby minimizing spatial requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible flat circuit connector projects from the front surface of the package substrate, then the electrical connection is achieved, but the surface area occupied increases and spatial clearance is reduced
Solution Approach 1:
The patent applies dimensionality change by routing the flexible flat circuit connector from the front surface to the back surface of the package substrate through conductive vias. This moves the connector connection point from the front surface plane to the back surface plane, effectively utilizing the third dimension (depth/thickness) of the substrate to resolve the spatial conflict. The connector still achieves electrical connection reliability but now exits from the back surface, reducing surface area occupation and improving clearance in small-scale display systems.
2Reliability
If the flexible flat circuit connector projects from the front surface, then electrical connection is established, but physical contact with nearby components occurs causing component failure
Solution Approach 1:
By routing the connector through the substrate depth to exit from the back surface rather than projecting from the front surface, the patent eliminates the harmful physical contact issue. The connector path is relocated to a different spatial dimension (through the substrate thickness), allowing it to avoid nearby components that would otherwise be in the path of a front-surface projecting connector, thus maintaining electrical connection reliability while eliminating the harmful physical contact.
3Reliability
If the flexible flat circuit connector projects from the front surface, then electrical connection is achieved, but assembly complexity increases due to reduced clearance
Solution Approach 1:
The patent simplifies assembly by utilizing the back surface of the package substrate for connector connection. This dimensional relocation provides adequate clearance around the connector, eliminating the assembly complications that arise from tight spatial constraints. The connector can now be properly positioned and connected without the interference of nearby components, reducing assembly complexity while maintaining electrical connection reliability.
Data Source
Figure 1
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Figure 3A~3B
AI summary
A microdisplay module (21) having a reduced size is disclosed. Conventional modules (e.g. of the LCOS type) require a large region of the package substrate (23) to accommodate and fix a flat flexible circuit connector (32) to them. The connector protrudes from the module in the same plane as the LCOS chip and the package substrate, additionally taking up significant space outside the module. In display systems with limited space there may be insufficient clearance, which can result in component failure and complicated assembly and testing. In the disclosed module, the flexible connector (32) is connected to the rear side of the package substrate (23). Electrical connection between the connector (32) and the module pads (28) on the front side are facilitated by via holes (29) passing through the substrate (23). The connector may be bent up around the edge of the package substrate to provide an improved clearance.