Microdisplay Pad Layer Protection for High-Resolution HMDs
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Solution Overview
Problem
Existing display devices, particularly those used in head-mounted displays, struggle to achieve high-resolution images due to structural limitations that can lead to damage during inspection processes and inefficient encapsulation methods.
Innovation Solution
A display device design featuring a thick pad conductive layer, multiple encapsulation inorganic layers with different thicknesses and materials, and a specific etching process to form lenses, ensuring structural integrity and efficient encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the pad conductive layer is made thinner to reduce device complexity, then the manufacturing process becomes simpler, but the pad conductive layer becomes vulnerable to damage during inspection processes
Solution Approach 1:
The patent applies prior cushioning by forming an insulating layer that covers and protects the pad conductive layer before inspection processes occur. This insulating layer acts as a protective cushion that prevents damage to the pad conductive layer during subsequent inspection, allowing the pad conductive layer to be thinner without compromising reliability.
2Ease of manufacture
If conventional etching methods are used to form lenses, then the manufacturing process is simpler, but the etching time increases and productivity decreases
Solution Approach 1:
The patent applies parameter changes by modifying the etching process parameters, specifically using a multi-step etching approach with different etching solutions and conditions. This optimized etching process reduces the total etching time while maintaining lens quality, thereby increasing productivity without sacrificing ease of manufacture.
3Ease of manufacture
If the display device structure is simplified, then manufacturing becomes easier, but the ability to provide high-resolution images may be compromised
Solution Approach 1:
The patent applies local quality by implementing a simplified overall structure while maintaining precise local features. The insulating layer is formed with specific thickness and material properties in critical areas (covering the pad conductive layer) to ensure both ease of manufacture and high-resolution image quality. This localized optimization allows simplification elsewhere in the device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides stable connections and protects the pad conductive layer from damage, enabling high-resolution image display while reducing the time required for encapsulation processes.
Implementation Method 1
a manufacturing process involving atomic layer deposition and dry etching to form lenses
Implementation Method 2
a manufacturing process involving atomic layer deposition and dry etching to form lenses
Data Source
AI summary
Provided are a display device, a method for manufacturing the display device, and a head mount display including the display device. A display device includes a substrate, a plurality of conductive layers sequentially stacked on the substrate, a reflective electrode layer on the plurality of conductive layers, a pad conductive layer on the plurality of conductive layers, an insulating layer covering at least a portion of the pad conductive layer and the reflective electrode layer, a plurality of light emitting elements on the insulating layer, each of the light emitting elements including a first electrode, a light emitting stack, and a second electrode, a first encapsulation inorganic layer on the second electrode, a second encapsulation inorganic layer on the first encapsulation inorganic layer, and an inorganic layer on at least a portion of a sidewall of the insulating layer in an opening exposing the pad conductive layer.