Microdisplay Assembly Packaging with Protruding Contacts

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Solution Overview

Problem

High costs of optical semiconductor devices such as DMDs, LCOS, and LCD microdisplay panels in projection systems, necessitating a reduction in component costs while maintaining high fidelity and picture quality.

Innovation Solution

A microdisplay assembly with a semiconductor workpiece mounted on a support, featuring a plurality of contacts with protruding features for reduced packaging costs and flexible connector options, allowing repeated testing without damaging bond pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional packaging methods are used for microdisplays, then the microdisplay can be protected and connected, but the packaging cost and overall assembly cost become excessively high

Engineering Contradiction:

Improvepackaging costVSAvoidconnection reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent uses a cost-effective packaging structure with a support board and simple bonding methods instead of expensive conventional packaging, achieving reliable connections at lower cost

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent modifies the bonding approach by using bonding pads on the support board that align with contact pads on the microdisplay, enabling reliable electrical and mechanical connections through optimized geometric parameters and material selection

Inventive Principle:

Principle #35Parameter changes

2Productivity

If bond pads are used for testing microdisplays, then electrical connections can be made, but repeated testing causes damage to the bond pads

Engineering Contradiction:

Improvetesting efficiencyVSAvoidbond pad integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent introduces contact pads as intermediary elements between the bond pads on the support board and the testing equipment probes. The contact pads are specifically designed to withstand repeated probing, protecting the bond pads from damage while enabling efficient testing

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent separates the bonding function (bond pads) from the testing function (contact pads), allowing each to be optimized independently. The contact pads are positioned and structured to handle mechanical probe contact, while bond pads maintain reliable electrical connections

Inventive Principle:

Principle #1Segmentation

3Adaptability or versatility

If standard connectors are used in microdisplay assemblies, then connections can be established, but flexibility in connector selection is limited and costs increase

Engineering Contradiction:

Improveconnector flexibilityVSAvoidassembly cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent creates a universal support board structure with bonding pads that can accommodate different microdisplay types and connector configurations. This standardized interface enables flexibility in connector selection while maintaining cost-effectiveness and simplifying the manufacturing process

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS7786747B2Microdisplay assemblies and methods of packaging microdisplays

Publication Date: 2010.08.31 TEXAS INSTRUMENTS INC

AI summary

Microdisplay assemblies, methods of packaging microdisplays, and methods of testing microdisplays are disclosed. In accordance with one embodiment, a microdisplay assembly includes a support and a microdisplay disposed on the support. The microdisplay includes a semiconductor workpiece mounted to the support and an optical device region disposed over the semiconductor workpiece. A plurality of contacts is disposed over a portion of the semiconductor workpiece, wherein each of the plurality of contacts comprises a protruding feature.