Microdriver Backplane Structure for Micro LED Integration
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Solution Overview
Problem
Current display technologies, such as those using TFTs and OLEDs, face limitations in energy efficiency, lifetime degradation, and moisture sensitivity, while integrating micro LEDs into high-resolution displays poses challenges due to complex circuitry and alignment tolerances in tight pixel spaces.
Innovation Solution
The integration of microdriver chips with a device layer and passivation layer, featuring conductive studs and trenches, allows for efficient electrical connection and bonding of micro LEDs on a display substrate, utilizing a patterned insulating layer and passivation fill layer to secure and insulate the micro LEDs, reducing light scattering and coupling with signal lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If micro LEDs are integrated into high-resolution displays with tight pixel spaces, then display resolution and energy efficiency are improved, but alignment precision and manufacturing complexity deteriorate due to complex circuitry and tight spacing
Solution Approach 1:
The display is segmented into modular units with standardized backplane structures. The backplane is divided into distinct regions (first backplane region, second backplane region) with dedicated contact pads and circuitry zones, allowing micro LEDs to be integrated in a systematic manner that improves alignment while maintaining high resolution
Solution Approach 2:
The patent utilizes vertical stacking and multi-layer backplane structures to accommodate complex circuitry without increasing lateral pixel density. By adding depth dimensions (multiple backplane layers, stacked contact pads), the design achieves high resolution and energy efficiency while simplifying the lateral alignment requirements
2Productivity
If circuitry density is increased in tight pixel spaces, then display resolution is improved, but device complexity and manufacturing difficulty worsen
Solution Approach 1:
Circuitry is segmented into functional regions on the backplane, with separate contact pad arrays for different purposes (anode, cathode, control signals). This modular circuitry layout increases effective circuitry density while reducing overall device complexity through systematic organization
Solution Approach 2:
The backplane structure serves multiple functions simultaneously: it provides mechanical support, electrical connections, signal routing, and alignment references. The standardized backplane design can accommodate different micro LED configurations, reducing manufacturing complexity while maintaining high circuitry density
3Productivity
If contact pads are placed closer together to increase pixel density, then display resolution is improved, but electrical insulation and shorting risks worsen
Solution Approach 1:
Electrical insulation is achieved by utilizing the vertical dimension with multi-layer backplane structures. Contact pads are stacked in different layers with insulating material between them, allowing closer lateral spacing while maintaining adequate electrical insulation through the added depth dimension
Solution Approach 2:
Insulating material is introduced as an intermediary between closely spaced contact pads. The backplane includes dedicated insulating layers and patterns that electrically isolate adjacent contacts while allowing them to be positioned closer together for higher pixel density
Data Source
AI summary
Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.