Microelectronic Device 3D Contact Array Pitch Reduction
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Solution Overview
Problem
Conventional semiconductor die and circuit board manufacturing processes face limitations in reducing terminal size and pitch due to etching process accuracy, leading to a reduced effective bonding area, which can be overcome by adopting semi-additive or RDL processes but at increased complexity and cost.
Innovation Solution
The implementation of a microelectronic device with a microfeature workpiece featuring a three-dimensional array of contacts, where passageways are created between apertures on opposite sides of the workpiece, allowing for closer spacing and increased bonding area without resorting to complex processes, using techniques like laser drilling or mechanical punching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching process is used to manufacture semiconductor dies and circuit boards, then manufacturing simplicity and lower cost are achieved, but terminal size and pitch cannot be reduced due to process accuracy limitations
Solution Approach 1:
The patent transitions from a two-dimensional surface array of terminals to a three-dimensional array by creating passageways through the substrate. This allows terminals to be arranged in multiple layers vertically, enabling pitch reduction without compromising manufacturing simplicity. The laser drilling or mechanical punching processes create vertical channels that accommodate stacked terminal arrangements, effectively adding a depth dimension to the terminal array geometry.
2Volume of moving object
If terminal pitch is decreased to reduce device size, then device compactness is improved, but effective bonding area is reduced due to etching process limitations
Solution Approach 1:
By stacking terminals in three dimensions through vertical passageways, the patent increases the effective bonding area available for wire connections while maintaining a compact footprint. Multiple bonding surfaces are created at different depths and lateral positions within the passageway structure, allowing sufficient bonding area without increasing the device's planar dimensions.
Solution Approach 2:
The patent nests multiple terminals and bonding surfaces within the three-dimensional space of vertical passageways. Terminals are arranged in nested configurations where bonding surfaces are positioned at various depths and radial positions within the same passageway volume, maximizing the use of available space for bonding while keeping the overall device compact.
3Manufacturing precision
If semi-additive or RDL processes are used to overcome etching limitations, then terminal pitch and bonding area can be improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces complex semi-additive or RDL manufacturing processes with simpler laser drilling or mechanical punching methods to create passageways. This substitution maintains the ability to achieve fine terminal pitch and adequate bonding area while significantly reducing manufacturing complexity and cost by using well-established, simpler fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a larger number of workpiece contacts with suitable bonding areas to be accessed from a smaller surface area, allowing for smaller microelectronic devices to be manufactured without the need for more complex or costly production methods, while maintaining effective bonding and structural integrity.
Implementation Method 1
using techniques like laser drilling or mechanical punching
Implementation Method 2
using techniques like laser drilling or mechanical punching
Data Source
Figure 1~2B
Figure 2C~2D
Figure 3
AI summary
Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.