Microelectronic Assemblies Standardized Connector Backplane Elimination
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Solution Overview
Problem
The development of standard microelectronic assemblies is hindered by the need for unique backplanes and point-to-point connections, which increase costs, time, and complexity due to signal routing requirements, mechanical constraints, and signal degradation issues.
Innovation Solution
Microelectronic modules are interconnected using a standardized connector for point-to-point connections, eliminating the need for a backplane and allowing modules to be configured in any order, thereby simplifying the assembly process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a backplane is used to route signals between printed wiring boards, then signal routing is achieved, but the assembly size and weight increase due to the additional perpendicular board requirement
Solution Approach 1:
The patent extracts and eliminates the backplane from the assembly by implementing direct point-to-point connections between printed wiring boards. This removal of the intermediary backplane component directly reduces assembly weight and simplifies the overall structure while maintaining signal routing functionality through alternative direct connection methods
2Reliability
If unique backplane interconnects are designed for each microelectronic module, then point-to-point connections are achieved, but development cost and time increase
Solution Approach 1:
The patent implements universal standardized connectors that can be used across all microelectronic modules regardless of their specific function or position in the assembly. This standardization allows the same connector design to serve multiple modules and configurations, eliminating the need for unique custom interconnect designs for each module while maintaining reliable point-to-point connections
3Strength
If a backplane is used for interconnection, then mechanical support is provided, but the housing must be redesigned as a solid metal structure, increasing manufacturing complexity
Solution Approach 1:
The patent segments the housing into modular components that can be independently manufactured and assembled. Instead of requiring a single solid metal housing structure to accommodate a backplane, the housing is divided into separate sections that can be produced using simpler manufacturing processes and then joined together, reducing overall manufacturing complexity
4Reliability
If backplane connectors are used to guard against signal degradation, then signal quality is maintained, but cost increases due to expensive guarded connectors
Solution Approach 1:
The patent employs cost-effective connector designs that provide adequate signal quality without the expense of heavily guarded backplane connectors. By using simpler, less expensive connector configurations in the point-to-point connection system, the patent maintains acceptable signal integrity while significantly reducing the overall assembly cost
Data Source
AI summary
Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector.