Microelectronic Assemblies With Vertical Interconnects
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Solution Overview
Problem
Current microelectronic package structures and processes fail to achieve optimal compactness and high-speed interconnectivity between complex chips, particularly in portable devices and data servers, due to limitations in interconnection density and signal propagation delays.
Innovation Solution
A microelectronic assembly with first and second support elements, where electrically conductive connectors project above the surfaces and are coupled, with encapsulation forming between the support elements to maintain connector height and prevent expansion, allowing for vertical interconnects with desirable standoff height and tight packing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If connectors are allowed to expand freely during assembly, then assembly process is simpler, but connector height cannot be maintained and interconnectivity is compromised
Solution Approach 1:
The encapsulation material is applied beforehand to the support element surfaces, creating a protective layer that prevents connector expansion during the subsequent assembly process. This prior cushioning approach maintains connector height and position while still allowing the assembly process to proceed without complex constraints.
Solution Approach 2:
The encapsulation material serves as an intermediary substance between the support elements and connectors, mediating the interaction by preventing direct contact and expansion. This intermediary layer allows the connectors to be joined without fearing direct mechanical interference, thus simplifying the assembly process while maintaining precision.
2Volume of moving object
If connectors are tightly packed to achieve compactness, then device size is reduced, but signal propagation delays increase
Solution Approach 1:
The invention transitions from horizontal planar arrangements to vertical three-dimensional stacking, allowing connectors to be tightly packed in the vertical dimension while maintaining adequate spacing for signal propagation. The encapsulation material enables this vertical arrangement by preventing expansion that would compromise connector alignment and signal integrity.
3Manufacturing precision
If encapsulation material is applied to prevent connector expansion, then connector height is maintained, but assembly process becomes more complex
Solution Approach 1:
The encapsulation material application is merged with the assembly process itself, where the encapsulation is applied to support elements and then connectors are joined in the same operational sequence. This combining of operations maintains precision without proportionally increasing overall process complexity.
Data Source
AI summary
A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. The first connectors, the second connectors or both may be partially encapsulated prior to electrically coupling respective pairs of first and second connectors in columns. A method may include arranging extremities of first connectors or second connectors in a temporary layer before forming the partial encapsulation.