Microelectronic Connection Component With Extended Bonding Leads
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Solution Overview
Problem
The rapid evolution of microelectronic elements necessitates an increase in the number of contacts and leads within a limited space, posing a challenge in efficiently utilizing available space for enhanced input/output capability.
Innovation Solution
A microelectronic connection component with a substrate featuring exposed terminals, wire bond pads, and bonding leads that extend beyond the substrate's edge, where conductive paths couple terminals to wire bond pads and bonding leads, allowing for flexible alignment and coupling with external contacts, thereby increasing input/output capability without requiring additional space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of contacts and leads is increased to enhance input/output capability, then the connectivity and performance are improved, but the available space is insufficient and space utilization becomes inefficient
Solution Approach 1:
The bonding leads extend beyond the peripheral edge of the substrate in directions other than the standard planar arrangement, utilizing three-dimensional space to increase the number of contacts without expanding the substrate footprint. This dimensional extension allows additional leads to access external contacts that would otherwise be unavailable in a two-dimensional layout.
Solution Approach 2:
The connection component is divided into multiple functional zones: wire bond pads for fine-pitch connections, bonding leads for extended reach, and terminals for through-substrate connections. Each segment serves a specific connectivity function, allowing the system to achieve high I/O capability by distributing connections across different spatial and functional segments rather than concentrating them in a single plane.
2Adaptability or versatility
If bonding leads are extended beyond the substrate edge to reach additional contacts, then connectivity is improved, but the structural complexity increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical insulation, conductive pathways for signals and power, and a mounting platform for various connection types (wire bonds, bonding leads, terminals). This multi-functionality reduces the need for additional separate components, thereby managing structural complexity while achieving enhanced connectivity.
Solution Approach 2:
The bonding leads are designed with flexibility to extend beyond the rigid substrate edge, allowing dynamic adaptation to different contact positions on the microelectronic element. This dynamic extension capability enables the connection component to accommodate variations in element geometry and contact layout without requiring a completely different structural design.
Data Source
AI summary
A microelectronic connection component includes a substrate having a first surface, a second surface and a peripheral edge. First and second terminals are exposed at the first surface of the substrate. Wire bond pads are exposed proximate the peripheral edge of the substrate at the first surface. First conductive paths couple the first terminals to the wire bond pads. Bonding leads extend beyond the peripheral edge of the substrate. Second conductive paths couple the second terminals to the bonding leads.