Microelectronic Collector With Dielectric Surface Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current manufacturing techniques for microelectronic devices with electrode and current collector parts face challenges such as short circuits due to the formation of whiskers from platinum current collectors during heat treatments, requiring additional insulation steps that are not always reliable or efficient.
Innovation Solution
A method involving a first current collector with a platinum upper portion and a second collector element made of a different material, where the second collector's material is transformed into a more electrically resistive surface layer to serve as a dielectric, eliminating the need for additional insulation deposits and ensuring precise and reliable electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a platinum current collector is used to withstand heat treatment under oxidizing atmosphere, then the collector can withstand the 300-700°C heat treatment, but the platinum collector generates whiskers that penetrate the insulating layer and cause short circuits
Solution Approach 1:
The current collector is divided into two distinct elements: a first collector element (platinum) for withstanding heat treatment, and a second collector element (different material) that forms the dielectric layer. This segmentation allows each element to have optimized properties for its specific function, preventing whisker formation while maintaining thermal resistance capability.
Solution Approach 2:
A dielectric element is introduced as an intermediary between the first collector and the second electrode/second collector assembly. This dielectric layer acts as a mediator that prevents electrical short circuits caused by platinum whiskers, while still allowing the system to withstand heat treatment.
2Reliability
If a dielectric element is added to prevent short circuits between the first collector and second electrode, then electrical insulation is improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The second collector element serves dual functions: it acts as both a current collector and the dielectric element. By merging these two functions into a single element, the need for separate dielectric layers is eliminated, reducing device complexity while maintaining electrical insulation reliability.
Solution Approach 2:
The second collector element is designed to perform multiple functions simultaneously: electrical conduction (as a collector) and electrical insulation (as a dielectric). This multi-functionality reduces the total number of components needed in the stack, simplifying the device structure.
3Reliability
If additional insulator layers are deposited to ensure reliable insulation, then electrical isolation is improved, but the manufacturing time and process complexity increase
Solution Approach 1:
The dielectric properties are built into the second collector element during its initial formation, before subsequent manufacturing steps. This preliminary incorporation of insulation functionality eliminates the need for additional insulator deposition steps, reducing manufacturing cycle time while ensuring reliable electrical isolation.
Solution Approach 2:
The second collector element inherently provides both conduction and insulation functions through its material properties and structure. It serves itself by eliminating the need for separate insulator layers, as its own modified material forms the dielectric element, thereby reducing manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents short circuits by creating a reliable dielectric element from the transformed second collector material, enhancing the manufacturing process by saving on additional deposition steps and ensuring consistent electrical isolation without the need for extra insulation layers.
Implementation Method 1
transforming, into a modified material, the material of only a part of the thickness of the upper portion of the second collector element so as to form a surface layer of modified material more electrically resistive
Implementation Method 2
a dielectric element configured to electrically isolate the second collector element and at least one of the second electrode and the second current collector
Data Source
Figure 1~6
Figure 7~9
AI summary
The present invention relates to a method for making a microelectronic device comprising successively: - the formation of a first current collector on a face of a substrate; - the formation of a first electrode (14) on, and in electrical continuity with, a portion of the first current collector; - a heat treatment configured to treat the first electrode (14) characterized in that: - the formation of the first collector comprises the formation of a first collector layer (12) on the face of the substrate and the formation of a second collector layer (13) covering at least a part, called the covered part, of the first collector layer (12) and having a first face in contact with the first electrode (14), the second collector layer (13) is configured to protect the covered part during the heat treatment, so that the heat treatment does not oxidize said covered part.