Microelectronic Package Element With Hollow Contacts
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Solution Overview
Problem
Current microelectronic packaging methods lack improvements in forming efficient electrical connections and heat dissipation for high-density and high-power microelectronic elements, with existing packages not adequately addressing the need for enhanced connectivity and thermal management.
Innovation Solution
A method involving the deformation of a metal sheet to create hollow contacts with upward and downward-facing contacts, which are electrically isolated and filled with a dielectric material, allowing for efficient electrical interconnection and potential integration of thermal conductors for heat dissipation, using techniques such as stamping and die-based processes, and application of dielectric materials through injection molding or stenciling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional substrates with conductive traces and via liners are used, then electrical connections can be established, but the packaging efficiency and heat dissipation capability are insufficient for high-density and high-power microelectronic elements
Solution Approach 1:
The package element is segmented into multiple functional regions: hollow contacts for electrical connection, dielectric material for insulation, and thermal conductor regions for heat dissipation. This segmentation allows each region to perform its specific function optimally, improving overall packaging efficiency while maintaining reliable electrical connections.
Solution Approach 2:
The package element structure integrates multiple functions into a single component: electrical connection through hollow contacts, thermal management through thermal conductor regions, and mechanical support through the deformed metal sheet. This multi-functionality improves packaging efficiency by eliminating the need for separate components while ensuring reliable electrical and thermal performance.
2Productivity
If high-density packaging is implemented, then more microelectronic elements can be mounted, but heat dissipation becomes more difficult
Solution Approach 1:
The package element incorporates local thermal management by integrating thermal conductor regions specifically in areas where heat dissipation is most needed. This localized approach allows high-density packaging while effectively managing heat at the source, preventing thermal buildup that would otherwise limit packaging density.
Solution Approach 2:
The package element uses composite construction combining metal sheet for structural integrity, dielectric material for electrical insulation, and thermal conductor materials for heat dissipation. This composite approach enables high-density packaging while maintaining effective thermal management through the thermal conductor regions.
3Reliability
If multiple conductive layers and via liners are used, then electrical connectivity is achieved, but the manufacturing complexity increases
Solution Approach 1:
The hollow contacts are formed in the deformed metal sheet before final assembly, pre-establishing the electrical connection pathways. This preliminary formation of conductive structures simplifies subsequent manufacturing steps while ensuring reliable electrical connectivity, reducing overall manufacturing complexity.
Solution Approach 2:
The invention extracts the essential electrical connection function into discrete hollow contacts that are formed and positioned separately before final assembly. This extraction simplifies the manufacturing process by allowing independent optimization of each contact structure while maintaining reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of microelectronic packages with improved electrical connectivity and thermal management, facilitating high-density packaging and enhanced reliability by ensuring efficient electrical interconnection and effective heat dissipation.
Implementation Method 1
deforming a metal sheet to form a plurality of hollow contacts
Implementation Method 2
application of dielectric materials through injection molding or stenciling
Data Source
AI summary
Microelectronic package elements and packages having dielectric layers and methods of fabricating such elements packages are disclosed. The elements and packages may advantageously be used in microelectronic assemblies having high routing density.