Microelectronic Assembly with Non-Solder Fine-Pitch Die Interconnects
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Solution Overview
Problem
Conventional microelectronic assemblies face challenges in reliably communicating large numbers of signals between multiple IC dies due to the small size of dies, thermal constraints, and power delivery limitations, which restricts design flexibility and efficiency.
Innovation Solution
The microelectronic assembly employs a package substrate with conductive pathways and non-solder interconnects, such as anisotropic conductive materials and metal-to-metal interconnects, to securely attach and interconnect multiple IC dies, enabling efficient power delivery and signal transmission while reducing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrates are used to couple integrated circuit dies, then mechanical stability is achieved, but interconnect pitch is constrained by manufacturing, materials, and thermal considerations
Solution Approach 1:
The substrate is divided into a first substrate portion and a second substrate portion, each with distinct functions. The first substrate portion provides mechanical support and thermal management, while the second substrate portion enables fine-pitch interconnects. This segmentation allows each portion to be optimized independently, resolving the contradiction between mechanical stability and interconnect pitch flexibility.
Solution Approach 2:
The second substrate portion acts as an intermediary between the integrated circuit dies and the first substrate portion. It provides the fine-pitch interconnect structure needed for high-density signaling while transferring mechanical and thermal loads to the more robust first substrate portion. This intermediary structure enables both fine pitch and mechanical stability to coexist.
2Productivity
If die size is reduced to increase integration density, then more components can be packed, but thermal constraints and power delivery limitations worsen
Solution Approach 1:
The patent transitions from planar thermal management to three-dimensional thermal management by implementing thermal vias that conduct heat vertically through the substrate layers. This dimensional change allows heat to be dissipated more efficiently from densely packed dies without increasing the footprint, resolving the contradiction between integration density and thermal constraints.
3Strength
If solder interconnects are used for attaching dies, then mechanical bonding is achieved, but manufacturing complexity and reliability concerns increase
Solution Approach 1:
The patent extracts the bonding function from the traditional solder interconnect approach and implements it through direct mechanical interlocking features and adhesive bonding. This removes the complexity of solder reflow processing, solder joint reliability concerns, and associated manufacturing variability, while maintaining strong mechanical bonding through alternative mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for reliable attachment of multiple IC dies with improved power efficiency, higher bandwidth, and greater design flexibility, particularly suitable for small and low-profile applications like wearable devices and industrial robots.
Implementation Method 1
the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects
Data Source
AI summary
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.