Microelectronic Package Conductive Members Eliminate Lead Frame Waste
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Solution Overview
Problem
Conventional microelectronic package manufacturing methods involving metal lead frames result in significant material waste and high costs due to the need for extensive material removal and processing.
Innovation Solution
A method using electrically conductive members, such as copper strip sections or wire sections, to establish connections with microelectronic devices without the need for a lead frame, where the members are adapted to fit the specific application and encapsulated with non-conductive material for protection and robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal lead frame is used to provide electrically conductive tracks and support the microelectronic device, then the package has required robustness and electrical connectivity, but significant material waste is produced and manufacturing costs increase
Solution Approach 1:
The lead frame is segmented into individual electrically conductive members (first, second, and third members) that can be independently positioned and connected to the microelectronic device. This segmentation allows for precise placement of only the necessary conductive elements, eliminating the need to manufacture and then remove excess material from a complete lead frame structure.
Solution Approach 2:
The invention extracts only the essential electrically conductive members needed for electrical connectivity from the conventional lead frame structure. By taking out only the necessary conductive elements (first member for electrical connection, second member for mechanical support, third member for additional connectivity) and eliminating the rest of the lead frame structure, material waste is significantly reduced while maintaining package robustness.
2Ease of manufacture
If a metal lead frame is manufactured by removing portions from a metal sheet, then electrically conductive tracks are formed, but manufacturing complexity and costs increase due to extensive material removal
Solution Approach 1:
Instead of the conventional approach of providing a complete metal sheet and removing portions to form the lead frame, the invention inverts the process by providing separate electrically conductive members and adding them only where needed. This inversion transforms a subtractive manufacturing process (cutting and removing material) into an additive process (positioning and connecting discrete members), significantly reducing material waste and simplifying manufacturing.
Solution Approach 2:
The electrically conductive members are prepared in advance as separate components with predetermined configurations before being positioned and connected to the microelectronic device. This preliminary preparation allows for optimized manufacturing of individual members without the complexity of shaping and cutting a complete lead frame, reducing both manufacturing steps and material waste.
3Quantity of substance
If conventional lead frame manufacturing is used, then electrically conductive tracks are provided, but the package size and complexity increase due to the lead frame structure
Solution Approach 1:
The invention applies local quality by providing electrically conductive members only in the specific locations where electrical connectivity is needed, rather than using a comprehensive lead frame structure. The first member connects to a first contact area, the second member provides mechanical support, and the third member connects to a second contact area - each member is precisely positioned to provide functionality only where required, reducing overall package complexity.
Data Source
AI summary
A method for manufacturing a microelectronic package (1) comprises the steps of providing at least two members (10, 11, 16) comprising electrically conductive material; providing a microelectronic device (15); placing the electrically conductive members (10, 11, 16) and the microelectronic device (15) in predetermined positions with respect to each other, and establishing electrical connections between each of the electrically conductive members (10, 11, 16) and the microelectronic device (15); and providing a non-conductive material for encapsulating the microelectronic device (15) and a portion of the electrically conductive members (10, 11, 16) connected thereto. The electrically conductive members (10, 11, 16) are intended to be used for realizing contact of the microelectronic device (15) arranged inside the package (1) to the external world. An important advantage of the method having steps as mentioned is that the electrically conductive members (10, 11, 16) as such are provided, wherein it is not necessary to provide a conventional lead frame which has the disadvantage of causing considerable waste of material during its manufacturing process.