Microelectronic Package Insulating Parts Conductive Members
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Solution Overview
Problem
The existing methods for manufacturing microelectronic packages require a metal lead frame, resulting in significant waste of metal material and increased costs, as they involve cutting and shaping metal sheets to create conductive tracks, which is inefficient and costly.
Innovation Solution
A method using electrically insulating parts, such as plastic, with embedded electrically conductive members that are positioned and sandwiched between these parts to create the microelectronic package, eliminating the need for a metal lead frame and allowing for cost-effective production by using only necessary components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If a metal lead frame is used to provide electrically conductive tracks, then electrical connection is achieved, but significant waste of metal material occurs and costs increase
Solution Approach 1:
The lead frame is divided into separate electrically conductive members that are independently positioned and connected to the microelectronic device, eliminating the need for a continuous metal sheet structure and reducing material waste
Solution Approach 2:
The patent replaces expensive metal lead frames with inexpensive plastic carrier substrates that serve the same functional purpose of supporting and connecting the microelectronic device, significantly reducing material costs
2Shape
If a metal lead frame is manufactured by removing portions from a metal sheet, then the desired lead frame shape is obtained, but approximately ten times the sheet surface is thrown away
Solution Approach 1:
Instead of starting with a complete metal sheet and removing unwanted portions, the patent uses plastic carrier substrates as the base material and adds only the necessary electrically conductive members, inverting the traditional manufacturing approach to minimize waste
Solution Approach 2:
The patent creates a composite structure combining plastic carrier substrates with electrically conductive members, replacing the homogeneous metal lead frame structure, which allows for more efficient material utilization and reduced waste
3Strength
If a carrier substrate is provided to support the microelectronic device, then robustness is ensured, but the manufacturing process becomes more complex
Solution Approach 1:
The plastic carrier substrate performs multiple functions simultaneously: it provides mechanical support and robustness, serves as an insulating base, and facilitates the positioning and connection of electrically conductive members, simplifying the overall manufacturing process
Data Source
AI summary
A method for manufacturing a microelectronic package (1) comprises the steps of providing two parts (13, 14) comprising electrically insulating material such as plastic; providing members (21, 22, 23) comprising electrically conductive material; providing a microelectronic device (30); positioning the electrically conductive members (21, 22, 23) and the microelectronic device (30) on the electrically insulating parts (13, 14); and placing the electrically insulating parts (13, 14) against each other, wherein the microelectronic device (30) and portions of the electrically conductive members (21, 22, 23) are sandwiched between the electrically insulating parts (13, 14). The electrically conductive members (21, 22, 23) are intended to be used for realizing contact of the microelectronic device (30) arranged inside the package (1) to the external world. An important advantage of the method having steps as mentioned is that the electrically conductive members (21, 22, 23) as such are provided, wherein it is not necessary to provide a conventional lead frame which has the disadvantage of causing considerable waste of metal material during its manufacturing process.