Microelectronic Package Carrier-Mediated Metal Element Formation
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Solution Overview
Problem
Conventional etching processes are limited in forming microcontacts with a high aspect ratio and arrays of microcontacts with small pitch or spacing, making it difficult to achieve effective mechanical and electrical connections in microelectronic packaging.
Innovation Solution
A microelectronic package design featuring a substrate with conductive elements and rigid metal elements joined by bonding metal, where a molded dielectric layer exposes the metal elements' end surfaces, allowing for flexible electrical and mechanical connections, and a method involving a carrier removal process to form the package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional etching processes are used to form microcontacts, then the manufacturing process is simple, but the aspect ratio and pitch of microcontacts are limited
Solution Approach 1:
A carrier is introduced as an intermediary substrate to form metal elements before transferring them to the final substrate. This carrier-mediated approach enables precise formation of high aspect ratio metal elements with small pitch that cannot be achieved by direct etching, while the carrier can be removed after transfer, leaving only the desired microcontact structures.
Solution Approach 2:
The formation process is segmented into distinct stages: forming metal elements on a carrier, transferring them to the substrate, and removing the carrier. This segmentation allows each stage to be optimized independently, enabling high precision microcontact formation without requiring the entire process to be complex.
2Reliability
If solder balls are used to bridge gaps between stacked packages, then mechanical and electrical connections are achieved, but the package height increases
Solution Approach 1:
The connection approach transitions from vertical stacking with tall solder balls to a more integrated three-dimensional structure where metal elements extend through the substrate thickness. This dimensional reconfiguration allows connections to be made with reduced overall height while maintaining mechanical and electrical reliability.
3Area of stationary object
If chip scale packages are used to reduce assembly area, then compact design is achieved, but interconnection structures become more constrained
Solution Approach 1:
The metal elements serve multiple functions simultaneously: they provide mechanical support, establish electrical connections, and enable precise alignment between stacked packages. This multi-functionality reduces the need for separate specialized structures, allowing compact chip scale packaging without proportionally increasing interconnection complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of microelectronic packages with improved mechanical and electrical connectivity, facilitating high-speed operations and compact designs by allowing for varied signal potentials and robust interconnects between packages.
Implementation Method 1
A bond metal joins the metal elements with the conductive elements
Data Source
AI summary
A method for making a microelectronic package includes the steps of providing a microelectronic assembly that further includes a substrate with a plurality of conductive elements thereon, a carrier, and a plurality of substantially rigid metal elements extending from the carrier and joined to the conductive elements; and removing the carrier from the microelectronic assembly to expose contact surfaces of the respective ones of the plurality of metal elements remote from the first conductive pads.