Microelectronic Device Packaging With Removable Support And Stress Testing
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Solution Overview
Problem
Conventional microelectronic device packaging methods, such as die-level and wafer-level packaging, face challenges including the inability to accurately test small bond-pads, high costs, and difficulties in forming robust wire-bonds, leading to inefficiencies and waste, especially in packages with multiple dies where a defective die can render the entire device inoperable.
Innovation Solution
A method involving attaching singulated microelectronic dies to a removable support member, covering them with a dielectric material, separating the dies, and stress testing before mounting, which allows for accurate testing and reduces waste by identifying defective dies early in the process, while also enabling stackable packaged devices to optimize surface area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If die-level packaging is used to attach individual dies to interposer substrates, then the bond-pads can be accurately contacted for testing, but the process becomes time consuming and expensive
Solution Approach 1:
The patent performs stress testing on the wafer-level packaged devices before singulation to identify defective dies. This preliminary action allows defective dies to be identified and isolated before individual die packaging, eliminating the need for time-consuming post-packaging testing and reducing overall packaging time while maintaining testing accuracy.
Solution Approach 2:
The patent segments the testing process into two stages: wafer-level packaging with preliminary stress testing before singulation, and post-singulation packaging for remaining devices. This segmentation allows efficient bulk processing of good dies while isolating defective ones, reducing total packaging time without compromising test accuracy.
2Area of stationary object
If wafer-level packaging is used to achieve high pin counts in small area, then the device density increases, but the devices are not as robust as die-level packaged devices
Solution Approach 1:
The patent performs preliminary stress testing on wafer-level packaged devices before singulation to identify and isolate defective devices. This allows the majority of good devices to proceed through efficient wafer-level packaging, while only a small number of defective devices require rework or discarding, maintaining both high density and robustness.
Solution Approach 2:
The patent uses an intermediary stress testing step between wafer-level packaging and final device completion. This intermediary process identifies weak or defective devices before they undergo final packaging, allowing for selective reinforcement or replacement while maintaining the overall high-density wafer-level approach.
3Reliability
If stress testing is performed after die attachment to conventional test sockets, then the testing can be conducted, but debris in sockets can damage the redistribution layers and dies
Solution Approach 1:
The patent performs stress testing on wafer-level packaged devices before singulation and before attachment to conventional test sockets. This preliminary testing eliminates the need for subsequent socket-based testing, preventing debris-related damage to redistribution layers and dies while maintaining testing accuracy through alternative testing methods.
Solution Approach 2:
The patent extracts the stress testing step from the post-singulation process and moves it to pre-singulation. This extraction eliminates the need for conventional test socket usage, thereby removing the source of debris-related damage while preserving the essential function of stress testing.
4Reliability
If conventional test sockets are used for stress testing after substrate attachment, then testing can be performed, but defective dies cause entire packaged devices to be discarded
Solution Approach 1:
The patent performs preliminary stress testing on wafer-level packaged devices before singulation to identify defective dies. This allows defective dies to be isolated and discarded individually, while operable dies proceed to packaging without being wasted. This preliminary action prevents the loss of entire packaged devices due to single die defects.
Solution Approach 2:
The patent segments the device population into defective and operable categories through preliminary stress testing before singulation. This segmentation allows for selective processing where only truly defective devices are discarded, while operable devices continue through the packaging process, minimizing waste of functional components.
Data Source
AI summary
Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic dies to a removable support member with an active side of the individual dies facing toward the support member, depositing a flowable material onto the dies and a portion of the removable support member such that the flowable material covers a back side of the individual dies and is disposed between adjacent dies, and removing the support member from the active sides of the dies.