Microelectronic Component Sealing via Conductive Pillars
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Solution Overview
Problem
The assembly of microelectronic devices sensitive to air and oxidizing species poses challenges due to the need for high-temperature annealing steps, which can damage components like lithium batteries and organic electronics, and existing sealing techniques fail to provide adequate protection against environmental gases.
Innovation Solution
A method involving the creation of a sealed case with electrically conductive pillars that establish electrical connections through passages in the device, allowing for low-temperature assembly and effective sealing against water vapor and oxygen transmission, using a substrate with through-vias and insulating resin to ensure electrical continuity and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature annealing steps (250-1100°C) are used for brazing and thermocompression, then reliable sealing and interconnection are achieved, but temperature-sensitive components like lithium batteries and organic electronics are damaged
Solution Approach 1:
The patent replaces thermal joining processes (brazing, thermocompression) with mechanical insertion of conductive pillars through passages. The pillars are inserted into pre-formed passages in the substrate and sealed with epoxy adhesive, eliminating the need for high-temperature annealing while achieving reliable electrical connection and sealing.
Solution Approach 2:
The invention changes the processing temperature parameter from high (250-1100°C) to low (room temperature or moderate curing temperature of epoxy). The sealing and interconnection are achieved through mechanical assembly and adhesive bonding rather than thermal processes, making the procedure compatible with temperature-sensitive components.
2Reliability
If traditional brazing techniques are used for interconnection, then electrical continuity is achieved, but the melting temperature of fusible materials exceeds the maximum operating temperature of components like lithium batteries (180°C)
Solution Approach 1:
The patent replaces brazing (thermal fusion process) with mechanical insertion of conductive pillars followed by epoxy sealing. The conductive pillars provide direct electrical pathways through the substrate without requiring melting or high-temperature bonding, enabling compatibility with low-temperature operating components.
Solution Approach 2:
The conductive pillars act as intermediaries that provide electrical connection without requiring thermal processing. The epoxy adhesive serves as a mediator that secures the pillars and provides sealing, replacing the fusible materials used in brazing that have melting points incompatible with sensitive components.
3Productivity
If high integration density is achieved through 3D assembly, then energy density increases, but sealing against oxidizing species becomes more difficult to maintain
Solution Approach 1:
The passages are pre-formed in the substrate before the assembly process. This preliminary action allows for precise positioning and alignment of conductive pillars, ensuring proper sealing contact between the pillar, passage walls, and epoxy adhesive. The pre-formed passages eliminate the need for high-temperature processing during assembly, protecting sensitive components while maintaining sealing integrity.
Solution Approach 2:
The sealing system uses a composite approach combining conductive pillars (for electrical connection), pre-formed passages (for positioning and structural support), and epoxy adhesive (for sealing and mechanical bonding). This composite structure achieves both high integration density through 3D assembly and reliable sealing against oxidizing species without requiring high-temperature processing.
Data Source
AI summary
The invention relates to an electronic system comprising at least one device comprising a substrate (110) carrying at least one electronic component provided with at least one electrical connector (121, 122), with the system further comprising a support of said device, characterised in that the device comprises at least one passage (361, 362) according to a dimension in thickness of the device, said passage passing through the electrical connector (121, 122), and in that it comprises at least one electrically conductive pillar (471, 472) protruding on a first face of the support, with the electrically conductive pillar (471, 472) passing through the passage (361, 362) by being configured to be in electrical continuity with the electrical connector (121, 122) passed through by said passage.