Microelectronic Assembly Shielding Case with Noise Suppression
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Solution Overview
Problem
Current microelectronic assemblies face desense issues due to external noise sources, particularly from high-speed signals like memory buses, which interfere with wireless communication frequencies, necessitating an effective electromagnetic shielding solution.
Innovation Solution
A microelectronic assembly with a substrate, side-by-side mounted digital/analog and RF IP blocks, a shielding case with an intermediate wall, and a noise suppressing structure directly on the first microelectronic component, electrically connected to the ground plane through a thermal interface material and conductive pads, minimizing noise radiation and maintaining heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding case is added to block electromagnetic interference, then EMI shielding performance is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The shielding case is divided into a base portion and a cover portion that can be separately manufactured and then assembled. The base portion includes sidewalls forming compartments, while the cover portion includes a lid that closes the compartments. This segmentation allows for easier manufacturing, assembly, and maintenance while achieving effective EMI shielding.
Solution Approach 2:
The first and second microelectronic components are disposed inside the shielding case, with each component potentially having its own internal shielding structures. The components are nested within the compartments formed by the base portion, creating a multi-layered shielding architecture that enhances EMI protection while managing complexity.
2Area of stationary object
If components are placed closer together to reduce device size, then area is reduced, but electromagnetic interference between components increases
Solution Approach 1:
The base portion of the shielding case includes sidewalls that define first and second compartments, physically separating the first and second microelectronic components. This segmentation allows the components to be placed in close proximity on the substrate while preventing electromagnetic interference between them through the shielding walls.
Solution Approach 2:
The shielding case provides localized electromagnetic shielding specifically at the locations where components are mounted. The sidewalls and lid create localized shielded environments around each component, allowing close component placement without compromising EMI performance in other areas of the device.
3Reliability
If a noise suppressing structure is added to reduce noise, then receiver sensitivity is improved, but manufacturing cost increases
Solution Approach 1:
The first microelectronic component is designed with integrated noise suppression capabilities, where the component itself generates or provides the noise suppressing structure. This self-service approach reduces the need for additional separate noise suppression components and simplifies the manufacturing process while maintaining improved receiver sensitivity.
Solution Approach 2:
The noise suppressing structure is combined with the shielding case structure, where the base portion and cover portion work together to provide both EMI shielding and noise suppression functions. This merging of functions reduces the total number of separate components needed and lowers manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses noise interference, meeting EMI standards without reducing heat dissipation efficiency and is cost-effective, providing a shorter noise suppression path and improved receiver sensitivity.
Implementation Method 1
a shielding case mounted on the substrate, wherein the shielding case comprises a plurality of sidewalls, one intermediate wall, and a lid... The first microelectronic component and the second microelectronic component are disposed in two separated compartments respectively within the shielding case
Implementation Method 2
A thermal interface material (TIM) layer is situated between the lid and the first microelectronic component
Data Source
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AI summary
A microelectronic assembly includes a substrate (10) and a first microelectronic component (20) mounted on the substrate (10). The first microelectronic component (20) includes a digital/analog IP block (201) and a RF IP block (202) . A shielding case (40) is mounted on the substrate (10). The shielding case (40) includes a plurality of sidewalls (401), one intermediate wall (402), and a lid (403). A thermal interface material, TIM layer (50) is situated between the lid (403) and the first microelectronic component (20). A noise suppressing structure (60) is interposed between the TIM layer (50) and the first microelectronic component (20).