Microelectronic Component Separation via Solvent-Soluble Adhesive
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Solution Overview
Problem
The chemical soak process used to remove microelectronic components from carrier substrates often results in corrosion and complicates the separation of individual packages, increasing manufacturing time and costs.
Innovation Solution
A method involving a support substrate with a release layer and a polymeric layer, where microelectronic die are embedded and encapsulated, allowing for mechanical separation without chemical solvents, using a combination of thermal and solvent-soluble adhesives and ejection members to lift the components from the carrier substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chemical soak is used to remove the panel from the carrier substrate, then the adhesive is dissolved and the panel can be removed, but the contact formations corrode and separation becomes more difficult
Solution Approach 1:
The adhesive layer is segmented into multiple functional layers: a first adhesive layer that is substantially insoluble in the solvent (resist corrosion) and a second adhesive layer that is soluble in the solvent (enables panel removal). This segmentation allows the system to achieve both panel removability and contact formation protection simultaneously.
2Ease of manufacture
If chemical soak is used to remove the panel from the carrier substrate, then the adhesive is dissolved, but the manufacturing time increases and costs increase
Solution Approach 1:
The carrier substrate is pre-configured with alignment features (alignment holes, alignment marks) and the adhesive layers are pre-applied with specific properties before the panel assembly is complete. This preliminary preparation enables rapid, precise panel removal without requiring lengthy chemical soaking processes, reducing manufacturing time while maintaining ease of manufacture.
3Strength
If conventional adhesive is used to attach the panel to the carrier substrate, then the panel can be securely attached, but the adhesive cannot be easily removed without chemical soak
Solution Approach 1:
The adhesive system exhibits local quality differentiation through its two-layer structure: the first adhesive layer provides strong, solvent-resistant bonding for secure attachment, while the second adhesive layer provides solvent-solubility for easy removal. This local quality variation within the adhesive system resolves the contradiction between strong attachment and easy removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach eliminates corrosion issues, reduces manufacturing time by 2-3 hours, and minimizes costs by avoiding chemical soaks, while ensuring precise alignment and efficient separation of microelectronic components.
Implementation Method 1
The adhesive material may include a solvent-soluble adhesive
Implementation Method 2
A force is applied to each of the plurality of portions in a direction away from the carrier substrate to remove the plurality of portions from the carrier substrate
Data Source
AI summary
Methods for forming electronic assemblies are provided. A device substrate having a plurality of electronic components embedded therein is provided. The device substrate is attached to a carrier substrate using an adhesive material. A plurality of cuts are formed through the device substrate to divide the device substrate into a plurality of portions. Each of the plurality of portions includes at least one of the electronic components. A force is applied to each of the plurality of portions in a direction away from the carrier substrate to remove the plurality of portions from the carrier substrate.