Microelectronic Element Replacement on Temporary Substrates
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Solution Overview
Problem
The manufacturing process of display panels with microelectronic elements often results in defective microelectronic elements, leading to reduced production yield and increased costs due to the need for inefficient replacement methods.
Innovation Solution
A method involving the use of a temporary substrate where defective microelectronic elements are replaced with identical or similarly properties second microelectronic elements, utilizing laser irradiation to detach and reattach elements with different buffer layers to ensure proper alignment and bonding, thereby improving yield and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional manufacturing processes are used to transfer microelectronic elements to display substrate, then production efficiency is maintained, but defective elements result in reduced production yield and increased costs
Solution Approach 1:
The patent applies preliminary action by introducing a temporary substrate that allows defective microelectronic elements to be identified and replaced before final transfer to the display substrate. This preliminary replacement process on the temporary substrate prevents defective elements from reaching the final product, thereby improving production yield without requiring complete remanufacturing of the display panel.
Solution Approach 2:
The patent uses a temporary substrate as an intermediary between the source substrate and the final display substrate. This intermediary platform enables the replacement of defective elements through buffer layers that facilitate detachment and reattachment processes, allowing quality control measures to be implemented without directly affecting the final display substrate.
2Reliability
If defective microelectronic elements are replaced on the display substrate directly, then production yield improves, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The patent performs the replacement operation in advance on a temporary substrate before the final transfer to the display substrate. By conducting the defective element replacement during the temporary substrate stage, the process avoids time-consuming operations on the final display substrate, thereby reducing overall replacement time while maintaining high production yield.
3Reliability
If microelectronic elements with different buffer layers are used for replacement, then defective elements can be effectively replaced, but alignment precision and bonding accuracy become more challenging
Solution Approach 1:
The temporary substrate serves as an intermediary platform that provides a controlled environment for replacing elements with different buffer layers. The buffer layers on the temporary substrate are designed to facilitate easy detachment and reattachment, allowing alignment and bonding operations to be performed under more favorable conditions before final transfer, thereby maintaining manufacturing precision despite material differences.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively replaces defective microelectronic elements, resulting in higher production yield and lower production costs by ensuring no defective elements are transferred to the final display panel, enhancing the efficiency and quality of the manufacturing process.
Implementation Method 1
utilizing laser irradiation to detach and reattach elements with different buffer layers
Data Source
AI summary
A manufacturing method of an electronic element module is provided. The method includes: disposing a plurality of first microelectronic elements on a first temporary substrate; and replacing at least one defective microelectronic element of the first microelectronic elements with at least one second microelectronic element. The first microelectronic elements and at least one second microelectronic element are distributed on the first temporary substrate. The first microelectronic elements and at least one second microelectronic element have same properties, and at least one of the appearance difference, the height difference and the orientation difference exists between the first microelectronic elements and at least one second microelectronic element. A semiconductor structure and a display panel are also provided.