Microelement Transfer System with In-Line Quality Testing
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Solution Overview
Problem
Conventional microelement transfer methods lack the ability to distinguish and separate qualified from unqualified microelements during the transfer process, resulting in both types being transferred to the receiving substrate, which affects the quality of microelement arrays in applications like display devices.
Innovation Solution
A transfer system and method that utilize a main pick-up device and a testing device with electrodes to test microelements for quality, allowing only qualified microelements to be transferred to a receiving substrate while unqualified ones are removed, using a combination of forces like electrostatic, van der Waals, and vacuum suction for precise handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional wafer bonding technique is used for directly transferring microelements, then the transfer process is simple, but both qualified and unqualified microelements are transferred together resulting in poor quality control
Solution Approach 1:
The transfer process is segmented into multiple independent stages: pickup stage, testing stage, and release stage. The pickup device can selectively pickup qualified microelements after testing, separating the transfer function from the quality control function. This resolves the contradiction by making the process more complex in steps but achieving precise quality control.
Solution Approach 2:
Testing is performed before the final transfer to the receiving substrate. The pickup device tests microelements on the donor substrate, identifies qualified ones, and then selectively transfers only those. This preliminary testing action ensures quality control is built into the transfer process itself.
2Productivity
If indirect transferring method is used with carrying substrate, then microelements can be transferred, but both qualified and unqualified microelements are still transferred resulting in quality issues
Solution Approach 1:
The pickup device incorporates testing capability that provides feedback about each microelement's quality. Based on this feedback, the device selectively releases only qualified microelements to the receiving substrate while retaining unqualified ones on the donor substrate. This feedback mechanism enables quality-controlled transfer.
Solution Approach 2:
The invention extracts the quality control function from the transfer process and integrates it into the pickup device. The pickup device can identify and separate qualified microelements from unqualified ones during pickup, taking out only the desired qualified elements for transfer while leaving unqualified ones behind.
3Productivity
If all microelements are transferred without classification, then transfer efficiency is high, but the quality of microelement array deteriorates
Solution Approach 1:
The pickup device dynamically adjusts its release characteristics based on real-time testing results. Qualified microelements are released to the receiving substrate while unqualified ones are retained. This dynamic control enables both efficient transfer of qualified elements and quality assurance.
Solution Approach 2:
Different treatment is applied to different microelements based on their individual quality characteristics. The pickup device can selectively release qualified microelements while retaining unqualified ones, applying different actions to different objects based on their local quality properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures high-quality transfer of microelements by distinguishing and separating qualified from unqualified elements, improving the resolution and brightness of display devices by ensuring only functional microelements are used in the array.
Implementation Method 1
The main pick-up device is operable to releasably pickup the microelements from the first carrier plate
Implementation Method 2
using a combination of forces like electrostatic, van der Waals, and vacuum suction for precise handling
Implementation Method 3
using a combination of forces like electrostatic, van der Waals, and vacuum suction for precise handling
Data Source
AI summary
A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.