Microfabricated Vacuum Switch Substrate Design
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Solution Overview
Problem
Current high-voltage vacuum switches are expensive and unreliable due to piece-part assembly, which affects their operating characteristics and makes them unsuitable for batch fabrication, necessitating a cost-effective and reliable method for producing high-voltage switches with precise performance.
Innovation Solution
A microfabricated electrical vacuum switch apparatus with an anode, cathode, and trigger electrode fabricated on a common substrate, sealed under a vacuum cover to create a vacuum environment, utilizing carbon materials like graphitic carbon, diamond-like materials, or carbon nanotubes for electron emission, and featuring channels to prevent surface breakdown.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If piece-part assembly is used to fabricate high-voltage vacuum switches, then individual components can be assembled, but manufacturing cost increases and reliability decreases due to assembly variations
Solution Approach 1:
The patent merges multiple discrete components (anode, cathode, trigger electrode, and substrate) into a single integrated structure fabricated on one substrate. This eliminates the need for piece-part assembly, ensuring consistent operating characteristics while simplifying manufacturing through batch fabrication processes.
Solution Approach 2:
The patent segments the vacuum switch into multiple functional regions on a single substrate, with each region containing specific components (anode regions, cathode regions, trigger electrode regions). This allows batch fabrication of complete devices while maintaining functional differentiation, resolving the contradiction between integration and manufacturing ease.
2Ease of manufacture
If piece-part assembly is used for vacuum switches, then components can be individually manufactured, but production cost increases
Solution Approach 1:
By combining multiple components into a single substrate-based structure, the patent enables batch fabrication of complete vacuum switches. This eliminates the need for separate manufacturing and assembly of individual parts, significantly reducing production costs while maintaining component functionality.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical insulation, and a platform for fabricating multiple components. This multi-functionality reduces the number of separate parts needed, lowering material costs and simplifying manufacturing.
3Ease of operation
If conventional vacuum switches are assembled from parts, then assembly is possible, but assembly variations affect operating characteristics
Solution Approach 1:
The patent combines all critical components (anode, cathode, trigger electrode) onto a single substrate with precisely defined spatial relationships. This eliminates assembly variations by ensuring fixed geometric configurations, while the substrate itself provides the mechanical framework that enables straightforward device integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables batch fabrication of hundreds of high-voltage vacuum switches with consistent performance, reducing costs and improving reliability by preventing surface breakdown and allowing for efficient electron emission and arc initiation, while maintaining high current-carrying capacity.
Implementation Method 1
various types of carbon materials can be used in the trigger electrode to provide electron emission for initiating a vacuum arc therein including graphitic carbon, diamond-like materials, and carbon nanotubes
Implementation Method 2
a cover sealed over the substrate to provide an evacuated region wherein the anode, the cathode and the trigger electrode are exposed to a vacuum environment
Data Source
AI summary
A microfabricated vacuum switch is disclosed which includes a substrate upon which an anode, cathode and trigger electrode are located. A cover is sealed over the substrate under vacuum to complete the vacuum switch. In some embodiments of the present invention, a metal cover can be used in place of the trigger electrode on the substrate. Materials used for the vacuum switch are compatible with high vacuum, relatively high temperature processing. These materials include molybdenum, niobium, copper, tungsten, aluminum and alloys thereof for the anode and cathode. Carbon in the form of graphitic carbon, a diamond-like material, or carbon nanotubes can be used in the trigger electrode. Channels can be optionally formed in the substrate to mitigate against surface breakdown.