Microfiber Mark Fabric Structure to Prevent Adhesive Seepage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional mark-fabric materials using composite fabrics with sublimation transfer suffer from adhesive layer seepage and transfer defects due to differences in melting points and pressure, leading to poor wash fastness and rub resistance, as well as distortion of designs during peeling.
Innovation Solution
A mark-fabric material comprising microfibers with a thermoplastic adhesive layer having a melt flow rate of 100g/10 min or less, and a release sheet, which prevents adhesive layer seepage during sublimation transfer by using a fabric with fibers ≤10 µm in diameter and a softening temperature below the sublimation temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional composite fabric with non-woven fabric and temporary adhesive is used for mark-fabric material, then the adhesive layer can be applied, but the adhesive layer seeps through during thermal pressing causing transfer defects
Solution Approach 1:
The invention removes the non-woven fabric and temporary adhesive layer from the composite fabric structure, using only the mark-fabric itself. This extraction eliminates the source of adhesive seepage while maintaining the necessary functions through direct adhesive application to the mark-fabric back surface.
Solution Approach 2:
The invention uses a composite structure of mark-fabric combined with thermoplastic resin having specific properties (melting point 100-150°C, viscosity 10-100 Pa·s). This composite material approach ensures the adhesive melts at the right temperature range to prevent seepage while maintaining bond strength.
2Manufacturing precision
If thermal pressing is performed at high temperature for sublimation transfer, then the sublimating dye transfers well, but the adhesive layer melts and seeps out onto the fabric surface
Solution Approach 1:
The invention changes the thermal parameters of the adhesive material by selecting thermoplastic resin with a melting point of 100-150°C, which is lower than the sublimation temperature. This parameter change ensures the adhesive remains stable during high-temperature sublimation transfer while still providing bonding capability.
Solution Approach 2:
The invention applies a release sheet to the adhesive layer before thermal pressing. This release sheet acts as a protective barrier that prevents adhesive seepage onto the fabric surface during the thermal pressing process, cushioning against the harmful effect of adhesive melting.
3Strength
If the adhesive layer is applied on composite fabric with non-woven fabric, then the mark can be adhered, but the wash fastness and rub resistance are poor
Solution Approach 1:
The invention removes the non-woven fabric layer from the composite structure, eliminating the weak interface that causes poor wash fastness and rub resistance. The adhesive is applied directly to the mark-fabric back surface, creating a more reliable bonded structure.
Solution Approach 2:
The invention uses a composite of mark-fabric and thermoplastic resin with specifically controlled viscosity (10-100 Pa·s) and melting point. This composite material provides both strong adhesion and durability against washing and rubbing forces.
4Ease of manufacture
If conventional mark-fabric material is used, then the mark can be formed, but the design distorts during peeling of the release sheet
Solution Approach 1:
The invention applies a release sheet with controlled adhesion properties to the adhesive layer. This release sheet prevents excessive adhesive flow during thermal pressing and allows clean peeling without design distortion, cushioning against the harmful effect of adhesive seepage.
Solution Approach 2:
The invention changes the viscosity parameter of the thermoplastic resin to 10-100 Pa·s, which provides optimal balance between adhesion strength and release characteristics. This parameter change ensures the adhesive bonds firmly during pressing but releases cleanly during peeling without distorting the design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses adhesive layer seepage and distortion, ensuring high-quality pattern transfer and improved wash fastness and rub resistance without the need for an intermediate layer, allowing for efficient production of marks with vivid color and design reproduction.
Implementation Method 1
an adhesive layer that includes a thermoplastic resin having a melt flow rate of 100g/10 min or less
Implementation Method 2
thermal pressing is performed using a heat press or the like
Implementation Method 3
the sublimation dye of the color, motif, design etc. printed onto the transfer paper using sublimating dye is caused to sublimate
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A mark-fabric material 20 includes a mark-fabric 21 including, in the following sequence, microfibers, an adhesive layer 22 including a thermoplastic resin having a melt flow rate of 100g/10 min or less, and a release sheet 23.