Micro-fluid Ejection Assemblies with Dual Etch Masks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing micro-fluid ejection assemblies face challenges in accurately forming fluid supply slots on silicon substrates due to top side silicon damage and undercutting of planarization layers during dry etching processes, leading to performance variability and delamination issues.
Innovation Solution
A method involving a first etch mask circumscribing the fluid supply slot location and a second etch mask applied over the substrate, with the second mask protecting the planarization layer during dry etching, reduces top side silicon damage and delamination by using a combination of hard and soft etch masks to control the etching process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dry etching is used to form fluid supply slots in silicon substrates, then manufacturing precision can be improved, but top side silicon damage and undercutting of planarization layers occur
Solution Approach 1:
The patent divides the etching process into multiple stages using different etch masks. A first etch mask is used to define the fluid supply slot location, then a second etch mask is applied to protect the planarization layer during subsequent etching. This segmentation allows precise slot formation while preventing damage to surrounding structures.
Solution Approach 2:
The planarization layer is applied to the silicon substrate before the etching process begins. This preliminary action creates a protective barrier that prevents top side silicon damage and undercutting during the dry etching of fluid supply slots, while still allowing precise slot formation.
2Ease of operation
If reentrant configuration is provided for fluid supply slots, then proper fluid flow is achieved, but top side silicon damage occurs
Solution Approach 1:
The planarization layer is applied to the silicon substrate before the etching process begins. This preliminary action creates a protective barrier that prevents top side silicon damage during the formation of reentrant fluid supply slots, while still allowing the slots to achieve their required reentrant configuration for proper fluid flow.
3Manufacturing precision
If deeper etching is performed to ensure complete fluid supply slot formation, then manufacturing precision is improved, but delamination of planarization layer increases
Solution Approach 1:
The planarization layer is applied to the silicon substrate before the etching process begins. This preliminary action creates a protective barrier that prevents delamination during deep etching operations, allowing complete fluid supply slot formation while maintaining layer adhesion.
Solution Approach 2:
The planarization layer serves as an intermediary protective layer between the etching process and the silicon substrate. It mediates the interaction between the etchant and the substrate, preventing harmful effects such as delamination while allowing precise slot formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of micro-fluid ejection assemblies with accurately formed fluid supply slots that meet critical tolerances, reducing top side silicon damage and delamination, thereby enhancing the reliability and performance of micro-fluid ejection devices.
Implementation Method 1
a first etch mask circumscribing a fluid supply slot location... A second etch mask is applied over at least some regions of the substrate other than the fluid supply slot location
Implementation Method 2
When dry etching a silicon substrate, parameters that are beneficial to one characteristic of the etched substrate are sometimes detrimental to another characteristic of the substrate
Implementation Method 3
One method for micromachining silicon substrates is a dry etching process such as deep reactive ion etching (DRIE) or inductively coupled plasma etching
Data Source
AI summary
A micro-fluid ejection assembly and method therefor. The micro-fluid ejection assembly includes a silicon substrate having a fluid supply slot therein. The fluid supply slot is formed by an etch process conducted on a substrate using, a first etch mask circumscribing the fluid supply slot, and a second etch mask applied over a functional layer on the substrate.