Microfluidic Chip Bonding via Pressure and Vacuum
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Solution Overview
Problem
Current methods for manufacturing and packaging microfluidic chips face issues such as adverse effects from organic reagents, residual chemicals inhibiting biochemical reactions, long production cycles, blockages in shallower micro channels, and the need for expensive and complex equipment, making them unsuitable for mass production and industrialized production.
Innovation Solution
A method involving the alignment of a substrate and a cover sheet with an adhesive interface, followed by vacuum packaging and pressure application to bond the layers, which can include using double-sided or single-sided adhesives sensitive to pressure, light, or temperature, to create a stable and bubble-free bond without the need for complex equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If organic reagents are used for surface treatment and bonding, then bonding can be achieved, but the organic reagents have adverse effects on biochemical reagents and may inhibit biochemical reactions
Solution Approach 1:
The patent extracts and eliminates organic reagents from the bonding process entirely. Instead of using organic solvents or reagents for surface treatment and bonding, the invention employs a mechanical bonding method where layers are aligned and bonded through pressure application, completely removing the harmful chemical substances from the process.
Solution Approach 2:
The patent replaces the chemical bonding system (using organic reagents) with a mechanical bonding system. The bonding is achieved through physical pressure and alignment of layers, substituting chemical interactions with mechanical forces to achieve the same bonding function without harmful effects.
2Adaptability or versatility
If traditional machining or injection molding is used to manufacture microfluidic chips, then functional units can be integrated, but the production cycle is long and unsuitable for mass production
Solution Approach 1:
The patent segments the chip manufacturing process into separate layers that can be independently prepared and then assembled. Instead of manufacturing the entire chip as a single integrated piece through traditional machining or injection molding, the chip is divided into multiple layers (substrate layer, functional unit layer, cover layer) that are fabricated separately and then bonded together, significantly reducing production time.
Solution Approach 2:
The patent applies preliminary action by pre-fabricating separate layers with their respective features before assembly. The substrate layer, functional units, and cover layer are prepared in advance as separate components, allowing parallel processing and reducing the overall production cycle time when they are quickly bonded together.
3Strength
If UV curing agent is applied through centrifugal force, then bonding can be achieved, but blockage in shallower micro channels occurs and surface smoothness is difficult to maintain
Solution Approach 1:
The patent replaces the UV curing agent application system with a direct mechanical bonding system. Instead of using centrifugal force to apply and cure UV adhesive, the invention uses straightforward pressure application to bond layers, eliminating the risk of UV agent blockage in micro channels and avoiding the need for high surface smoothness.
Solution Approach 2:
The patent extracts and eliminates UV curing agents and centrifugal force application from the bonding process. By using simple pressure-based bonding, the harmful effects of UV agent accumulation in micro channels and the requirement for high surface smoothness are completely removed.
4Strength
If laser bonding is used, then bonding can be achieved, but high heat generated may destroy and deactivate biological samples
Solution Approach 1:
The patent replaces the thermal bonding system (laser bonding) with a mechanical bonding system. Instead of using laser-induced heat to bond layers, the invention employs direct pressure application at or near room temperature, substituting thermal energy with mechanical energy to achieve bonding without damaging biological samples.
Solution Approach 2:
The patent extracts and eliminates laser heating from the bonding process. By using pressure-based mechanical bonding instead of thermal bonding, the harmful high heat that would destroy biological samples is completely removed from the process.
5Strength
If complex auxiliary instruments and devices are used for chip packaging, then bonding can be achieved, but the equipment is complicated and expensive
Solution Approach 1:
The patent extracts and eliminates complex auxiliary instruments and devices from the packaging and bonding process. By using a simple pressure application method that can be performed with basic equipment, the invention removes the need for expensive and complicated auxiliary devices while maintaining effective bonding.
Solution Approach 2:
The patent replaces complex packaging and bonding equipment with a simple mechanical pressure application system. The bonding process uses straightforward pressure and alignment mechanisms rather than complex auxiliary instruments, significantly reducing equipment complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves high-strength bonding, prevents micro-channel blockages, reduces production time, and enables low-cost, mass production of microfluidic chips with high fidelity to designed microstructures, suitable for both short-term and long-term storage and shipping without additional cleaning or sterilization.
Implementation Method 1
an adhesive material is provided at an interface between the substrate and the cover sheet
Implementation Method 2
removing air or gas from the package, for example, the sealed package with the assembly in it
Implementation Method 3
applying a pressure on the packaged assembly... to bond the first the second layers into a chip
Data Source
AI summary
In one aspect, disclosed herein are methods for packaging biochips, including microfluidic chips. The method can comprise bonding a substrate and a cover slide, packaging the bonded chip, creating a vacuum in the package, and applying a pressure on the packaged chip. The method is particularly useful for minimizing bubble formation during low-cost and mass production of microfluidic chips.