Microfluidic Chip Substrate Film Bonding and Bubble Removal
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Solution Overview
Problem
The existing microfluidic chip manufacturing process faces challenges with substrate alignment and bonding, leading to increased time, cost, and precision issues, as well as difficulties in removing bubbles from the fluid channel without additional equipment or chemical processes.
Innovation Solution
A microfluidic chip is manufactured by bonding a substrate with a film, which simplifies the process, improves precision, and incorporates a bubble removal structure within the chip to prevent bubbles from interfering with optical measurements, eliminating the need for external devices or chemical processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple substrates are bonded together to form fluid channels in different layers, then fluid flow and mixing capability is improved, but manufacturing time and cost increase due to alignment and bonding processes
Solution Approach 1:
The invention divides the microfluidic chip into two functional parts: a substrate containing through-holes and a film containing surface channels. This segmentation allows each part to be manufactured independently and then assembled, eliminating the need for complex multi-substrate alignment while maintaining the capability for multi-layer fluid flow and mixing.
Solution Approach 2:
The invention transitions from a planar multi-layer substrate structure to a three-dimensional structure where channels extend through the substrate thickness. By utilizing the vertical dimension (through-holes penetrating the substrate) combined with surface channels on the film, the design achieves multi-layer fluid handling without requiring multiple bonded substrates.
2Adaptability or versatility
If multiple substrates are bonded together to form fluid channels in different layers, then fluid flow and mixing capability is improved, but manufacturing cost increases due to alignment and bonding processes
Solution Approach 1:
The invention divides the microfluidic chip into two functional parts: a substrate containing through-holes and a film containing surface channels. This segmentation allows each part to be manufactured independently and then assembled, eliminating the need for complex multi-substrate alignment while maintaining the capability for multi-layer fluid flow and mixing.
Solution Approach 2:
The invention transitions from a planar multi-layer substrate structure to a three-dimensional structure where channels extend through the substrate thickness. By utilizing the vertical dimension (through-holes penetrating the substrate) combined with surface channels on the film, the design achieves multi-layer fluid handling without requiring multiple bonded substrates.
3Measurement precision
If bubbles are removed from fluid channels using external equipment or chemical processes, then measurement accuracy is improved, but device complexity and cost increase
Solution Approach 1:
The invention incorporates a bubble removal structure that is integrated into the microfluidic chip itself, allowing the system to remove bubbles autonomously without requiring external equipment or chemical processes. The structure uses the fluid flow dynamics and channel geometry to trap and remove bubbles at specific locations within the chip.
Solution Approach 2:
The bubble removal function is merged with the fluid channel structure by incorporating removal structures directly into the channel walls or boundaries. This integration eliminates the need for separate bubble removal systems and allows bubble removal to occur as part of the normal fluid flow process.
Data Source
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AI summary
According to embodiments of the present invention, a microfluidic chip, a manufacturing method therefor and an analysis device using the same are provided. The microfluidic chip comprises: a substrate comprising an inflow part through which a fluid flows in, a fluid channel through which the fluid moves and an outflow part through which the fluid flows out; and a film attached to the substrate to protect at least one of the inflow part, the outflow part and the fluid channel from the outside, wherein the inflow part and the outflow part are implemented by penetrating through the surface of the substrate, and the fluid channel can be implemented by being sunk from the surface of the substrate.