Microfluidic Chip Direct Printing with Array Femtosecond Laser Interference

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Solution Overview

Problem

Current microfluidic chip preparation technologies suffer from poor processing efficiency, low intelligence, and limited controllability, making it difficult to manufacture complex three-dimensional structures efficiently and accurately.

Innovation Solution

A method and device utilizing a large-format array femtosecond laser with adjustable parameters to achieve direct printing of microfluidic chips, enabling complex three-dimensional structures by regulating interference states, combinations, and exposure modes, along with ultrasonic-assisted etching to create micro-channels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional processing methods (molding, hot pressing, photolithography) are used, then manufacturing process is simple, but manufacturing precision and structural complexity are limited to surface two-dimensional structures

Engineering Contradiction:
Improvemicro-channel structure precisionVSAvoidprocessing system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical processing methods (molding, hot pressing, photolithography) with femtosecond laser processing technology. The femtosecond laser enables direct three-dimensional micro-channel structure fabrication with sub-micron precision through photothermal ablation, eliminating the need for complex mechanical molding processes and achieving true 3D structuring capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes the ultra-short pulse duration parameter of femtosecond laser (10^-15 seconds) to achieve non-thermal melting processing. This parameter change enables precise material removal with minimal heat-affected zone, achieving manufacturing precision at the sub-micron level while maintaining material integrity and enabling complex three-dimensional structures.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If single beam femtosecond laser scanning is used, then processing accuracy is high, but processing efficiency is poor

Engineering Contradiction:
Improvechip preparation efficiencyVSAvoidmicro-channel processing accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent segments the single femtosecond laser beam into multiple parallel beams using beam splitting optics. This segmentation enables simultaneous processing of multiple micro-channels or micro-functional parts in parallel, dramatically improving chip preparation efficiency from sequential single-beam scanning to concurrent multi-beam fabrication while maintaining sub-micron processing accuracy through precise beam control.

Inventive Principle:
Principle #1Segmentation

3Productivity

If multiple beams are used for parallel processing, then processing efficiency improves, but controllability and intelligence are reduced

Engineering Contradiction:
Improveprocessing efficiencyVSAvoidprocessing controllability
Core Design Contradiction:
ProductivityVSExtent of automation

Solution Approach 1:

The patent implements a closed-loop feedback control system with real-time monitoring of each femtosecond laser beam's parameters (position, energy, pulse duration). The system dynamically adjusts beam parameters based on feedback from position sensors and processing quality detection, maintaining high controllability and intelligence even when processing multiple beams in parallel, thereby preserving automation capability while achieving improved efficiency.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly enhances processing efficiency, stability, flexibility, and intelligence, allowing for the rapid and precise manufacturing of microfluidic chips with complex structures, suitable for various materials like glass and polymers.

Implementation Method 1

the femtosecond laser processing technology has been widely adopted in the processing of various materials... The femtosecond laser can be used to process the micro-channels of the microfluidic chip

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

Due to the features of non-thermal melting property, high accuracy, three-dimensional spatial resolution, low energy consumption, and sub-micron or even nano-level processing sizes, the femtosecond laser processing technology has been widely adopted

Methodology Applied
Scientific EffectNon-thermal melting:

Implementation Method 3

along with ultrasonic-assisted etching to create micro-channels

Methodology Applied
Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Data Source

PatentUS12017213B2Device and method for direct printing of microfluidic chip based on large-format array femtosecond laser
Publication Date: 2024.06.25 SHANGHAI LANGYAN OPTOELECTRONICS TECH CO LTD
  • US12017213B2 patent drawing
  • US12017213B2 patent drawing
  • US12017213B2 patent drawing

AI summary

A device and a method for direct printing of a microfluidic chip based on a large-format array femtosecond laser. The large-format array femtosecond laser with multi-parameter adjustable laser beam state is used to achieve large-format laser interference. The interference state, interference combination and exposure mode of the large-format array femtosecond laser are regulated, and multiple exposures are superimposed to output the desired pattern for the microfluidic chip, enabling the direct printing processing of the microfluidic chip.