Microfluidic Chip Assembly for Rapid Digital PCR Temperature Cycling
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Solution Overview
Problem
Existing digital PCR systems face issues such as manual droplet transfer leading to loss or breakage, slow PCR processes due to large sample containers, and limited temperature control capabilities, especially for microfluidic chips, resulting in prolonged reaction times and inefficient temperature cycling.
Innovation Solution
A microfluidic chip assembly with integrated heat sink, semiconductor cooler, and heat-conducting plate, along with a thin film layer and pneumatic press plate, enabling rapid temperature control and droplet generation on a single chip, using a semiconductor heating device for high throughput and precise temperature management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If droplets are manually transferred to a 96-well plate for PCR, then the PCR reaction can be performed, but droplet loss or breakage occurs and the process time increases
Solution Approach 1:
The patent merges the droplet generation and PCR reaction functions into a single microfluidic chip. The microfluidic chip integrates reaction chambers, droplet generation structures, and temperature control systems, eliminating the need for manual transfer to separate 96-well plates. This integration maintains droplet integrity while significantly reducing process time by enabling direct PCR amplification on-chip.
2Productivity
If samples are placed in a 96-well plate for high throughput PCR, then multiple samples can be processed simultaneously, but the thermal capacity increases and temperature cycling speed decreases
Solution Approach 1:
The patent segments the PCR reaction into multiple independent reaction chambers on a single microfluidic chip. Each chamber can process droplets independently with rapid temperature cycling. The chip design allows parallel processing of multiple samples through integrated temperature control zones, achieving high throughput without the thermal inertia of large 96-well plates. The segmented architecture enables fast heating and cooling rates while maintaining productivity.
3Productivity
If a large temperature control area is used to process multiple samples simultaneously, then throughput increases, but the thermal capacity increases and heating/cooling speed decreases
Solution Approach 1:
The patent implements local quality by creating distinct temperature control zones within the microfluidic chip. Each reaction chamber or region can be independently controlled with optimized thermal characteristics. This allows different areas of the chip to be heated or cooled at different rates and temperatures, enabling rapid temperature cycling for multiple samples simultaneously without the compromise of a single large thermal mass. The local quality approach maintains fast response times while achieving high throughput through parallel zone control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system allows for rapid temperature cycling with heating and cooling rates exceeding 14.6 C/s and 8.8 C/s, respectively, reducing thermal capacity and eliminating droplet transfer steps, thus enhancing the efficiency and speed of digital PCR processes.
Implementation Method 1
a heat sink arranged below the microfluidic chip, a semiconductor cooler arranged between the heat sink and the microfluidic chip
Implementation Method 2
semiconductor cooler arranged between the heat sink and the microfluidic chip
Implementation Method 3
a heat-conducting plate arranged above the semiconductor cooler, where a thin film layer is bonded at a bottom of the microfluidic chip and the thin film layer abuts against the heat-conducting plate
Data Source
AI summary
A microfluidic chip assembly for rapidly performing digital polymerase chain reaction (PCR) and use thereof are provided. The microfluidic chip assembly includes at least one microfluidic chip, a heat sink arranged below the microfluidic chip, a heater arranged above the microfluidic chip, a semiconductor cooler arranged between the heat sink and the microfluidic chip, and a heat-conducting plate arranged above the semiconductor cooler. A thin film layer is bonded at the bottom of the microfluidic chip, and the thin film layer abuts against the heat-conducting plate.