Microfluidic Cooling Structure for 3D IC Hot Spot Management
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Solution Overview
Problem
Conventional cooling techniques for high-density 3D integrated circuit packages are inadequate in managing heat dissipation, leading to localized hot spots and reduced performance and reliability due to increased power density.
Innovation Solution
The implementation of a microfluidic cooling structure with monolithically integrated microchannel heat sinks, electrical through-silicon vias, fluidic through-silicon vias, and micropipe interconnects that enable both electrical and fluidic interconnections between stacked IC dies, allowing for efficient heat removal using a thermofluidic interconnect network with adjustable fluidic channel dimensions for optimized heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling techniques with heat sinks are used, then the structure is simple and easy to manufacture, but they cannot meet the cooling needs of high power density 3D packages and create localized hot spots
Solution Approach 1:
The cooling structure is segmented into multiple through-wafer vias distributed across the substrate, with each via containing an internal fluid channel. This segmentation allows heat to be removed from multiple localized regions simultaneously, preventing hot spots while maintaining a relatively simple overall structure that can be manufactured using standard via processes.
Solution Approach 2:
The fluid channels are nested within the through-wafer vias, creating a compact integrated structure where the cooling function is embedded within the existing via infrastructure. This nesting approach enables efficient heat removal without adding significant structural complexity, as the cooling channels utilize the vertical space already allocated for electrical interconnects.
2Quantity of substance
If components are placed closer or stacked together to increase density, then device dimension and cost are reduced, but power density increases and conventional cooling becomes inadequate
Solution Approach 1:
The cooling approach transitions from a planar surface-mounted heat sink to a three-dimensional network of through-wafer vias with internal channels. This vertical dimensionality allows heat to be extracted from multiple layers of stacked components simultaneously, enabling effective cooling of high-density 3D packages where conventional two-dimensional cooling surfaces are insufficient.
Solution Approach 2:
The invention employs fluid circulation through the nested channels in the through-wafer vias to remove heat from high-density component stacks. The fluid-based cooling system efficiently transports thermal energy away from concentrated power density regions, enabling sustained operation of high-component-density packages without overheating.
3Ease of operation
If through-wafer vias are used for electrical connection, then vertical interconnect is achieved, but additional fluidic channels need to be integrated for cooling
Solution Approach 1:
The through-wafer vias are designed to serve dual functions: electrical interconnection and fluidic cooling transport. By integrating both electrical conductors and fluid channels within the same via structures, the invention eliminates the need for separate cooling infrastructure, thereby reducing overall device complexity while maintaining effective cooling capability across high-density 3D packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation across 3D IC packages by creating non-uniform heat removal regions with varying fluidic channel sizes, ensuring optimal cooling efficiency and temperature uniformity, thereby enhancing the reliability and performance of high-density integrated circuit packages.
Implementation Method 1
convection cooling structures, which may include microfluidic cooling structures, such as a microchannel heat sink and/or micropipe interconnects
Implementation Method 2
micropipe interconnects that may facilitate both fluidic and electrical interconnects between the IC dies
Data Source
Figure 1
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Figure 2B
AI summary
An integrated circuit package may include an integrated circuit die having first and second circuit regions and a surface. The first circuit region of the integrated circuit package has an operating temperature that is different than that of the second circuit region. A cooling structure is formed on the surface of the integrated circuit die. The cooling structure includes a group of micropipe interconnects arranged to form a cooling channel that allows for the flow of coolant. The cooling channel includes first and second subchannels. The first sub-channel has a first size that allows a higher flow rate of the coolant to cool the first circuit region. The second sub-channel has a second size that allows a lower flow rate of the coolant to cool the second circuit region.