Microfluidic Liquid Cooling Module With Finned Internal Ducts
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Solution Overview
Problem
Modern electronic devices face significant thermal management challenges due to increasing power consumption and compact sizes, as air cooling reaches its limits, and existing liquid cooling solutions struggle to effectively dissipate heat in high-power devices with complex exterior parts that cannot fit into compact designs.
Innovation Solution
A liquid cooling module with a microfluidic structure, sealing pad, and internal circulating liquid ducts within fins, allowing for efficient heat transfer and fluidic communication, along with a compact design that includes a pump, temperature sensors, and control circuit for optimized thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If air cooling is used for thermal management, then device simplicity is maintained, but heat dissipation capability is insufficient for high-power devices
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a cooling liquid circulation system with pumps, channels, and heat exchange structures. The cooling liquid flows through channels in contact with the semiconductor device, absorbing heat more efficiently than air cooling, thereby resolving the insufficient heat dissipation capability while accepting the necessary increase in system complexity.
2Power
If liquid cooling systems with complex exterior auxiliary parts are used, then heat dissipation capability is improved, but compactness is reduced and cannot fit into compact devices
Solution Approach 1:
The patent merges the cooling liquid reservoir, pumps, channels, and heat exchange structures into an integrated cooling system that is combined with the semiconductor device package. This integration eliminates the need for separate exterior auxiliary parts, reducing the overall volume and enabling the system to fit into compact devices while maintaining high heat dissipation capability.
Solution Approach 2:
The cooling system components are nested within the semiconductor device package structure. The cooling channels are formed within the package substrate, and the heat exchange structures are positioned in close proximity to the device, creating a compact nested arrangement that maximizes heat dissipation while minimizing external volume.
3Power
If cooling liquid temperature is increased to improve heat absorption, then heat dissipation efficiency is improved, but energy loss increases
Solution Approach 1:
The patent implements a continuous circulation system where the cooling liquid is constantly pumped through the channels, continuously absorbing heat from the semiconductor device. This continuous action maintains optimal temperature differential for heat absorption while the recirculation system minimizes energy loss by reusing the cooling liquid rather than requiring continuous heating or replacement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves aggressive heat removal with reduced energy costs and coolant volume, maintaining low temperatures and high heat dissipation capabilities, outperforming conventional metal heat sinks by reducing maximum chip temperature by over 50% and dissipating more than three times the heating power.
Implementation Method 1
a cooling core including a microfluidic structure configured to carry a cooling liquid
Implementation Method 2
a sealing pad configured to transmit heat from an electronic device to the cooling core
Implementation Method 3
each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure
Data Source
AI summary
Various embodiments may relate to a liquid cooling module. The liquid cooling module may include a main body. The main body may include a cooling core including a microfluidic structure configured to carry a cooling liquid. The main body may also include a plurality of slots. The liquid cooling module may further include a sealing pad configured to transmit heat from an electronic device to the cooling core. The liquid cooling module may additionally include a plurality of fins extending from the main body, each of the plurality of fins including an internal circulating liquid duct such that the liquid cooling module includes a plurality of internal circulating liquid ducts in fluidic communication with the microfluidic structure.