Embedded Microfluidic Cooling for High-Heat Optoelectronics
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Solution Overview
Problem
Thermal management of optoelectronic devices is challenging due to high heat density dissipations in compact devices, with existing solutions like TECs being energy-inefficient and costly, and alternative methods like solid-state conduction and multi-phase systems having limited capacity.
Innovation Solution
An embedded microfluidic distribution apparatus using a working fluid that undergoes phase change to passively remove heat through evaporation and condensation processes, forming a closed loop fluid distribution circuit with micro-structures to manage high heat density dissipations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks and fans are used for cooling, then cooling capability is provided, but device complexity and power consumption increase
Solution Approach 1:
The microfluidic channels are integrated directly into the semiconductor die structure, with channels formed within the substrate layers. This nesting approach embeds the cooling function within the device itself, eliminating separate heat sinks and fans while providing passive cooling through the layered substrate configuration
Solution Approach 2:
The system uses passive cooling where coolant flows through microfluidic channels without requiring active pumping components. The cooling structure serves itself by utilizing the natural flow of coolant through the integrated channels, eliminating the need for external power-consuming cooling mechanisms
2Temperature
If microfluidic channels are integrated into the semiconductor die, then cooling efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The substrate is divided into multiple functional layers including first and second substrate layers with distinct microfluidic channels formed in each. This segmentation allows independent formation and optimization of cooling channels in different layers, reducing the precision burden on any single manufacturing step while achieving effective heat distribution
Solution Approach 2:
The invention utilizes layering and material property variations to achieve passive cooling. By changing the physical parameters of different layers (porosity, thermal conductivity, channel dimensions) and their arrangement, the system optimizes cooling efficiency while accommodating manufacturing tolerances through the distributed layered structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides an energy-efficient, scalable solution for passive heat removal in optoelectronic devices, overcoming the limitations of TECs by utilizing phase change mechanisms for effective heat dissipation.
Implementation Method 1
an embedded microfluidic distribution apparatus for passively cooling optoelectronic devices
Data Source
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AI summary
A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro- structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro- scale dimensions.