Microfluidic Electrochemical Cooling for Dense Photonics Power Delivery
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Solution Overview
Problem
Conventional processing units face challenges in efficient power delivery and thermal management as the density of compute resources increases, leading to limited space for communication, power delivery, and heat removal.
Innovation Solution
A microfluidic system utilizing an electrochemical fluid that generates electrical current to power and absorbs heat from the load, integrated within a substrate, allowing for simultaneous power and cooling through ion transfer across membranes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional discrete power supplies and cooling systems are used, then power delivery and thermal management functions are provided, but device complexity and space requirements increase
Solution Approach 1:
The patent combines separate power delivery and cooling systems into a single integrated microfluidic system. The microfluidic channels deliver both electrical power (via embedded conductors) and cooling fluid through the same substrate structure, eliminating the need for discrete power supplies and separate cooling systems, thereby reducing device complexity while maintaining functional reliability
Solution Approach 2:
The microfluidic substrate performs multiple functions simultaneously: it serves as a mechanical support structure, an electrical power delivery network (through embedded conductors), and a thermal management system (through fluid circulation channels). This multi-functionality consolidates what were previously separate systems into one universal platform
2Productivity
If compute resource density increases, then processing capacity improves, but available space for power delivery and heat removal decreases
Solution Approach 1:
The patent transitions from planar power and cooling delivery to three-dimensional microfluidic channels embedded within the substrate. The microchannels extend vertically and horizontally through multiple layers of the substrate, utilizing the third dimension (depth) to deliver power and cooling close to compute resources without increasing the device footprint, thus enabling higher density
3Ease of operation
If separate power and cooling systems are used, then functional requirements are met, but space utilization is inefficient
Solution Approach 1:
The patent merges power delivery conductors and cooling fluid channels into a single integrated microfluidic substrate structure. The conductors and channels are embedded together in the same substrate layers, allowing both power and cooling to be delivered through the same physical pathway, maximizing space utilization and eliminating redundant infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables localized and efficient power delivery and thermal management, enabling higher processor density in computing devices by eliminating the need for separate power and cooling systems, thus optimizing space utilization.
Implementation Method 1
electro chemically converting chemical energy of the working fluid within the micro fluidic volume into an electrical current that at least partially powers the electrical load
Implementation Method 2
absorbing heat from the electrical load into the working fluid to produce a heated working fluid
Implementation Method 3
rejecting heat from the heated working fluid to create a cooled working fluid
Data Source
AI summary
A device may include a substrate. A device may include an electrical load supported by the substrate. A device may include a microfluidic volume disposed in the substrate. A device may include an electro-chemical fluid contained in the microfluidic volume, the electro-chemical fluid being configured to (i) generate an electrical current that powers the electrical load and (ii) absorb heat from the electrical load. A method may include a substrate. A method may include an electrical load supported by the substrate. A method may include a microfluidic volume disposed in the substrate. A method may include an electro-chemical fluid contained in the microfluidic volume, the electro-chemical fluid being configured to (i) generate an electrical current that powers the electrical load and (ii) absorb heat from the electrical load.