3D Integrated Chips with Microfluidic Cooling Pin Fins
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Solution Overview
Problem
Conventional cooling systems for computing devices face challenges in efficiently managing heat due to limited surface area and thermal management capabilities, leading to potential damage from high temperatures and reduced performance.
Innovation Solution
The implementation of a stacked-die processor with microfluidic volumes and pin fins, featuring through-silicon vias (TSVs) and boiling enhancement surface features, enhances heat transfer by promoting vapor bubble formation and release, thereby improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional cooling systems are used, then the structure is simple, but the heat transfer surface area is limited and thermal management capability is insufficient
Solution Approach 1:
The patent transitions from planar heat transfer surfaces to three-dimensional pin fin structures within microfluidic channels. The pin fins extend vertically into the fluid flow path, creating a multi-dimensional heat transfer surface that dramatically increases the effective area for thermal exchange between the solid structure and cooling fluid.
Solution Approach 2:
The patent employs a porous boiling enhancement coating on the pin fin surfaces, which introduces a porous structure that promotes bubble nucleation and enhances phase change heat transfer. This porous layer increases the effective surface area and provides numerous nucleation sites for vapor bubble formation, thereby improving thermal management capability.
2Reliability
If conventional cooling systems are used, then the system is easy to manufacture, but thermal management capability is insufficient leading to component damage
Solution Approach 1:
The patent utilizes phase change heat transfer by promoting boiling of the cooling fluid. The porous coating on pin fins creates numerous nucleation sites that facilitate controlled vapor bubble formation and collapse, leveraging the latent heat of vaporization to dramatically increase heat removal efficiency and protect components from thermal damage.
Solution Approach 2:
The patent combines multiple materials and structures: pin fins made from conductive material, microfluidic channels with controlled geometry, and a porous boiling enhancement coating. This composite structure integrates different functional properties (thermal conduction, fluid flow control, bubble nucleation) to achieve superior thermal management reliability.
3Temperature
If heat transfer surface area is increased using pin fins, then thermal management improves, but device complexity increases
Solution Approach 1:
The pin fin structures serve multiple functions simultaneously: they provide thermal conduction pathways from heat-generating components, create turbulence in the fluid flow to enhance convective heat transfer, and serve as substrates for the porous boiling enhancement coating. This multi-functionality reduces the need for separate components and justifies the increased structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively increases the surface area for heat transfer, reduces temperature, and extends the operational lifetime of heat-generating components by efficiently removing thermal energy.
Implementation Method 1
The liquid working fluid receives heat from the heat-generating components
Implementation Method 2
the working fluid vaporizes, introducing vapor into the liquid of the working fluid
Implementation Method 3
carrying thermal energy away from the heat-generating components in the gas phase via the latent heat of boiling
Implementation Method 4
the vapor working fluid which rises out of the liquid phase
Implementation Method 5
a condenser to condense the vapor working fluid back into the liquid phase
Data Source
AI summary
A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.