Microfluidic Die Support Substrates for Inkjet Cartridges
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Solution Overview
Problem
The high cost of flexible interconnects in traditional inkjet systems, particularly in disposable inkjet cartridges, is a significant manufacturing expense due to their expensive nature and frequent replacement.
Innovation Solution
The development of rigid, semi-flexible, and semi-rigid supports that allow microfluidic dies and electrical contacts to be positioned on different physical planes and locations, eliminating the need for flexible interconnects by using a rigid substrate with electrical contacts on one side and the microfluidic die on the other, or incorporating a flexible portion that can be bent up to 90 degrees to align the contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible interconnects are used to couple microfluidic die and electrical contacts on different planes, then positioning flexibility is improved, but manufacturing cost increases
Solution Approach 1:
The support structure utilizes three-dimensional positioning to place electrical contacts and microfluidic die on different planes and locations. The support extends in multiple dimensions with electrical contacts on a first plane and microfluidic die on a second plane, eliminating the need for flexible interconnects while maintaining positioning flexibility.
Solution Approach 2:
The invention uses a rigid support structure that copies the functional capability of flexible interconnects (positioning components on different planes) but implements it through a different, cheaper mechanism - a rigid multi-plane support structure rather than flexible wiring assemblies.
2Ease of manufacture
If rigid supports with electrical contacts on opposite sides are used, then manufacturing cost is reduced, but positioning adaptability is limited
Solution Approach 1:
The rigid support structure achieves positioning flexibility through three-dimensional configuration. Electrical contacts are positioned on a first plane and the microfluidic die on a second plane at different locations, utilizing vertical and horizontal separation to achieve various positioning requirements without flexible interconnects.
Solution Approach 2:
The support structure is divided into distinct functional zones: a first end with electrical contacts on a first plane, and a second end with a microfluidic die on a second plane. This segmentation allows each end to be optimized for its specific function while maintaining overall structural rigidity.
Data Source
AI summary
The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.