Microfluidic Chip Fixing Clamp With 3D Port Arrangement
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Solution Overview
Problem
Microfluidic chips face challenges with high-pressure conduit detachment, debris contamination, and increased size due to multiple connecting ports, leading to higher costs and reduced usability.
Innovation Solution
A fixing clamp with sub-clamps and a spacing adjusting mechanism, featuring upper and lower plate bodies with docking ports and Luer joints, allows for compact port arrangement on both surfaces, reducing chip size and experimental costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple connecting ports are arranged on both ends of the microfluidic chip, then the experimental functionality is improved, but the chip area increases leading to higher costs
Solution Approach 1:
The patent transitions from arranging connecting ports only on the upper surface (2D arrangement) to arranging ports on both upper and lower surfaces (3D spatial arrangement). This dimensional expansion allows multiple connecting ports to be positioned at both ends of the chip without increasing the planar area, thereby maintaining compact chip size while enhancing experimental functionality.
2Power
If high pressure is applied during use, then the fluid flow capability is improved, but the conduit easily falls off the microfluidic chip
Solution Approach 1:
The fixing structure is segmented into multiple components: upper cover plate, lower cover plate, fixing clamps, and sealing rings. Each component performs a specific function - the sealing rings create pressure distribution, the fixing clamps provide mechanical constraint, and the cover plates distribute loads. This segmentation allows the system to withstand high pressure while maintaining reliable conduit connections.
Solution Approach 2:
The patent incorporates sealing rings between the cover plates and microfluidic chip, and between the conduits and cover plates, to create cushioning effects before high pressure is applied. These sealing elements distribute the pressure and prevent direct stress concentration at the conduit connection points, thereby preventing conduit detachment during high-pressure operation.
3Ease of manufacture
If the microfluidic chip is bonded with flat joints, then the manufacturing process is simplified, but the chip can only be used once and bonding may pollute channels
Solution Approach 1:
The patent extracts the bonding function from the permanent flat joint connection and replaces it with a detachable fixing clamp system. The fixing clamps mechanically secure the cover plates to the microfluidic chip without permanent bonding, allowing the chip to be disassembled, cleaned, and reused multiple times while eliminating bonding-related channel pollution.
Data Source
AI summary
A fixing clamp for a microfluidic chip includes a set of sub-clamps arranged to be spaced apart on left and right. Each of the sub-clamps includes an upper plate body with a first passage, the first passage having a first outer interface and a first chip docking port, and the first chip docking port being located on a lower surface of the upper plate body and at one end of the upper plate body facing the other sub-clamp; a lower plate body with a second passage, the second passage having a second outer interface and a second chip docking port, and the second chip docking port being located on an upper surface of the lower plate body and at one end of the lower plate body facing the other sub-clamp; and a spacing adjusting mechanism connecting the upper plate body and the lower plate body together.