Microfluidic Housing Wall for Semiconductor Heat Dissipation

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Solution Overview

Problem

Existing semiconductor component encapsulation technologies face challenges in efficiently dissipating heat generated by high power density components, leading to temperature increases that affect performance and reliability due to thermal resistances at material interfaces.

Innovation Solution

A housing with a micro-fluid cooling device integrated into the support wall, using a second material like silicon for the cooling device, which allows direct contact with the semiconductor component and features micromachined channels for heat transfer fluid circulation, minimizing thermal resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heat is dissipated through multiple materials and interfaces in traditional encapsulation, then the semiconductor component is protected and connected, but thermal resistance increases and heat dissipation efficiency decreases

Engineering Contradiction:

Improvecomponent protection and connectionVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent merges the support wall and cooling device into a single integrated structure where the cooling device is inserted directly into the support wall. This eliminates the need for separate thermal interface materials and reduces the number of interfaces, thereby minimizing thermal resistance while maintaining structural support and protection functions.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The cooling device is nested within the support wall structure, with the cooling device inserted into the support wall. This nested configuration allows direct thermal contact between the semiconductor component, cooling device, and support wall, creating an efficient heat dissipation path without adding external components.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Ease of manufacture

If traditional encapsulation uses homogeneous materials for support and cooling, then manufacturing is simplified, but thermal contact resistance increases at interfaces

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidthermal contact resistance

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent employs a composite structure where the support wall and cooling device are made of different materials optimized for their specific functions. The support wall provides mechanical strength and support, while the cooling device provides thermal conduction. This composite approach reduces thermal contact resistance while maintaining ease of manufacture through the insertion assembly method.

Inventive Principle:

Principle #40Composite materials

3Loss of energy

If a cooling device is added as a separate component, then heat dissipation is improved, but device complexity and assembly steps increase

Engineering Contradiction:

Improveheat dissipationVSAvoidassembly complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The support wall and cooling device are merged into a single integrated assembly where the cooling device is inserted into the support wall. This integration reduces the number of separate components and assembly steps, simplifying the overall device structure while maintaining effective heat dissipation functionality.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances heat dissipation by reducing thermal resistance, improving the reliability and performance of semiconductor components through efficient heat transfer.

Implementation Method 1

the micro-fluid cooling device comprising at least one circulation channel of a heat transfer fluid connected to a first inlet orifice of the heat transfer fluid and to a second outlet orifice of the heat transfer fluid

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

at least one circulation channel of a heat transfer fluid... dissipation of the heat flow generated by the semiconductor component(s) is improved

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentEP4246570B1Housing for encapsulating electronic component(s) and associated electronic assembly

Publication Date: 2025.12.10 THALES SA

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AI summary

This housing for encapsulating electronic component(s), forming a receptacle intended to receive at least one electronic component (4), comprising a first support wall (8) having an inner face (14) adapted to receive the electronic component(s) (4), and an outer face, further comprises a micro-fluidic cooling device (20) in a second material, inserted in said first support wall (8), the micro-fluidic cooling device (20) comprising at least one channel (22) for the circulation of a heat transfer fluid connected to a first inlet orifice (24) of the heat transfer fluid and to a second outlet orifice (26) of the heat transfer fluid, the cooling device (20) comprising at least one platform (28) for receiving the electronic component(s) (4) in contact with said at least one channel (22) for the circulation of a heat transfer fluid.