Microfluidic Substrate With Integrated Hydrophobic Dielectric Layer

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Solution Overview

Problem

Existing digital microfluidic biochips face issues such as low production yield due to foreign objects piercing the dielectric film and poor adhesion between the hydrophobic layer and dielectric layer, which complicates the manufacturing process and reduces efficiency.

Innovation Solution

A microfluidic substrate with a dielectric layer that integrates hydrophobic groups and columnar structures, eliminating the need for a separate hydrophobic layer, enhancing hydrophobic performance and adhesion, and improving production yield by simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a separate hydrophobic layer is added to the dielectric layer, then hydrophobic performance is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvehydrophobic performanceVSAvoidlayer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the hydrophobic layer and dielectric layer into a single integrated dielectric layer with columnar structures. The columnar structures provide both dielectric function and hydrophobic function simultaneously, eliminating the need for separate layers. This merging reduces structural complexity while maintaining both dielectric performance and hydrophobic performance.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated dielectric layer uses composite material design where columnar structures (providing hydrophobicity) are formed within the dielectric material matrix. This composite structure achieves both dielectric properties and hydrophobic properties in a single layer, resolving the contradiction between performance improvement and complexity increase.

Inventive Principle:
Principle #40Composite materials

2Reliability

If multiple layers (dielectric layer and hydrophobic layer) are used, then hydrophobic performance is improved, but manufacturing yield decreases due to foreign object damage

Engineering Contradiction:
Improvehydrophobic performanceVSAvoidproduction yield
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

By merging the hydrophobic layer and dielectric layer into one integrated layer, the patent reduces the number of interfaces and layers where foreign objects can cause damage. The single-layer structure with columnar structures eliminates the vulnerability of multi-layer structures to foreign object piercing, thereby improving production yield while maintaining hydrophobic performance.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If multiple layers are used, then hydrophobic performance is improved, but manufacturing process complexity increases

Engineering Contradiction:
Improvehydrophobic performanceVSAvoidmanufacturing process simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent simplifies the manufacturing process by combining two separate layer formation processes into one. The integrated dielectric layer with columnar structures can be formed in a single manufacturing step, eliminating the need for sequential deposition of dielectric layer and hydrophobic layer, thereby improving ease of manufacture while achieving hydrophobic performance.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated dielectric layer with hydrophobic groups and columnar structures improves hydrophobic performance, reduces the risk of foreign object damage, and enhances the ability to control test liquid movement, thereby increasing production efficiency and yield.

Implementation Method 1

a molecular structure of the dielectric material has a hydrophobic group

Methodology Applied
Scientific EffectHydrophobic effect: Hydrophobe

Implementation Method 2

the thickness of the dielectric layer is determined according to a relationship expression... V is a voltage applied to the electrode substrate, θ0 is an initial contact angle of a test liquid on the dielectric layer, θ is a contact angle of the test liquid on the dielectric layer under action of the applied voltage

Methodology Applied
Scientific EffectElectrowetting: Electrowetting

Data Source

PatentUS12533670B2Microfluidic substrate and manufacturing method therefor, and microfluidic chip
Publication Date: 2026.01.27 BEIJING BOE OPTOELECTRONCIS TECH CO LTD
  • US12533670B2 patent drawing
  • US12533670B2 patent drawing
  • US12533670B2 patent drawing

AI summary

A microfluidic substrate includes an electrode substrate and a dielectric layer disposed on a side of the electrode substrate. The dielectric layer includes a dielectric material, and a molecular structure of the dielectric material has a hydrophobic group.