Microfluidic Interface With Dynamic Force Control
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Solution Overview
Problem
Current technologies for interfacing microchips with supporting hardware lack robust and reliable connection methods, leading to compromised microchip performance and limited application in real-world scenarios due to the need for custom housings, manual adhesion processes, and permanent fittings that can contaminate or fail over time.
Innovation Solution
A fluidic probe system with telescoping connections and a dynamic force monitoring mechanism that allows for automated, non-permanent, low and high-pressure connections to microfluidic devices without bonding or adhering, enabling precise and repeatable seals that withstand temperature cycling and material fatigue, and includes integrated leak sensing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual adhesion processes are used to connect fittings to microchips, then connections can be made, but the process is time-consuming and requires user expertise
Solution Approach 1:
The patent replaces manual adhesion processes with an automated compression mechanism that uses controlled mechanical force to create seals. The compression device applies predetermined forces through compression members to seal fittings to the microchip substrate without requiring manual bonding operations, thereby automating the connection process and eliminating the need for user expertise in manual adhesion techniques.
Solution Approach 2:
The patent employs controlled compression force parameters to achieve reliable sealing. By varying and optimizing the compression force applied during the sealing process, the system creates effective seals without requiring time-consuming manual adhesion steps. The predetermined compression forces are carefully selected to ensure proper sealing while maintaining connection integrity.
2Reliability
If permanent fittings are used to interface microchips, then connections are stable, but they can contaminate or fail over time
Solution Approach 1:
The patent divides the connection system into separable components: a reusable compression device and replaceable fittings or seal members. This segmentation allows the sealing elements to be periodically replaced without replacing the entire interface system, preventing contamination buildup and fatigue-related failures while maintaining connection stability through repeated use of the compression mechanism.
Solution Approach 2:
The patent employs disposable or replaceable seal members and fittings that can be exchanged when contaminated or worn. These consumable components are designed to be replaced rather than permanently retained, preventing contamination and failure while the expensive compression device and control systems are reused. This approach maintains reliability through periodic renewal of sealing elements.
3Adaptability or versatility
If custom housings are used for each microchip design, then specific connection requirements are met, but device complexity increases
Solution Approach 1:
The patent employs a universal compression device that can interface with multiple microchip designs and substrate types. The compression mechanism is designed to work with various fitting configurations and substrate materials through programmable force application and adjustable positioning, eliminating the need for custom housings for each microchip design while maintaining adaptability to specific connection requirements.
Solution Approach 2:
The patent uses a dynamic, programmable compression system that can adjust its parameters based on the specific microchip design being interfaced. The compression force, positioning, and timing can be dynamically modified through software control to accommodate different substrate materials, fitting types, and connection geometries, providing versatility without requiring physical customization of the housing for each application.
4Strength
If bonding or adhering processes are used, then fittings are securely attached, but the process requires heat that can affect heat-sensitive materials
Solution Approach 1:
The patent replaces thermal bonding processes with a purely mechanical compression system. The compression device applies controlled mechanical forces to create secure attachments without generating heat that could affect heat-sensitive materials. The predetermined compression forces are sufficient to create strong, reliable connections through friction and compression alone, eliminating the need for thermal processing steps.
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3
AI summary
The invention allows for the formation of robust, reproducible, non-permanent connections to microchips. The connections are formed using either indexing arms or multiple fitting holder heads which are capable of forming a compression seal to a port located at any position on the surface of the microchip. The sealing force is user-defined and can be tightly controlled with integrated force sensors. In addition, the sealing force is monitored with a force sensor and force compensation mechanism ensuring that the desired force is maintained. The device is compatible with all microchip architectures. Alterations to the microchip surface is avoided as connections are established using instrumentation rather than processing steps. Further, the process is automatable allowing for exchanging microchips and subsequently creating electrical and fluidic connections in an automated fashion. Optionally, the integration of leak sensors to monitor leaks are included.