Microfluidic Thermal Transport Layer for LED Heat Dissipation
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Solution Overview
Problem
Commercial LEDs face heat dissipation challenges, which affect their lifetime and luminous flux, particularly in applications where increased operating temperature alters their color or wavelength, and existing thermal management systems often increase module size and generate noise.
Innovation Solution
A light-emitting article with a thermal transport layer, including a microfluidic layer with a coolant, is secured to the display layer to efficiently transport heat away from the light-emitting device, using materials like polymeric and silica-based materials with nano-thick metal thin films, and inorganic materials for effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink with fan or piezoelectric jet actuator is used to dissipate heat, then heat dissipation capability is improved, but device size and footprint increase
Solution Approach 1:
The patent employs a microfluidic cooling system where a coolant flows through microchannels formed directly in the substrate beneath the LED. This hydraulic approach replaces traditional air-cooled heat sinks with fans, achieving superior heat dissipation through direct liquid contact while minimizing the required footprint to merely the area under the LED chip.
Solution Approach 2:
The invention transitions from three-dimensional heat dissipation structures (heat sinks extending above the module) to a two-dimensional planar cooling solution. The microchannels are formed within the substrate plane, allowing heat to be dissipated laterally through the substrate to peripheral heat sink regions, thereby reducing vertical height and overall module footprint.
2Temperature
If a heat sink with fan or piezoelectric jet actuator is used to dissipate heat, then heat dissipation capability is improved, but noise generation increases
Solution Approach 1:
The patent employs a microfluidic cooling system where a coolant flows through microchannels formed directly in the substrate beneath the LED. This hydraulic approach replaces traditional air-cooled heat sinks with fans, achieving superior heat dissipation through direct liquid contact while minimizing the required footprint to merely the area under the LED chip.
Solution Approach 2:
The invention replaces the mechanical fan system (which generates noise through rotating blades moving air) with a passive microfluidic cooling system. The coolant flow is driven by thermal convection and capillary action within the microchannels, eliminating the need for noisy mechanical components while maintaining effective heat dissipation.
3Loss of energy
If LED operating temperature increases, then thermal energy conversion improves, but useful lifetime and luminous flux stability deteriorate
Solution Approach 1:
The patent converts the harmful thermal energy that would otherwise degrade LED performance into a beneficial cooling mechanism. The waste heat from the LED is captured and transferred through the substrate to the microfluidic coolant system, which efficiently carries it away. This transforms the thermal problem into a controlled heat transfer process that maintains LED operating temperature and extends lifetime.
Solution Approach 2:
The substrate serves as a thermal intermediary between the LED chip and the coolant. It conducts heat laterally from the LED junction to the microchannel regions where the coolant absorbs the thermal energy. This intermediary heat transfer path enables efficient thermal management while maintaining the LED's electrical and optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal transport layer effectively dissipates heat, maintaining the LED's operating temperature and extending its lifetime while minimizing size and noise, ensuring consistent luminous flux and color stability.
Implementation Method 1
The microfluidic layer includes a coolant that can transport heat generated by the light-emitting device away from the light-emitting device
Implementation Method 2
a thermal transport layer secured to the display layer... effectively dissipate heat energy
Data Source
AI summary
An article includes a display layer having an outward facing surface and an inward facing surface. The display layer includes a light-emitting device that generates heat and light during use. A thermal transport layer may be secured to the display layer. The thermal transport layer may include a microfluidic layer including a coolant that can transport heat generated by the light-emitting device away from the light-emitting device. An article includes a display structure having a height, a width, and a thickness that define a volume. The display structure can include components that emit light to generate a three-dimensional image within the volume. The display structure includes a stack. The display structure also includes a thermal dissipation layer in contact with the sheet or stack that can transport generated heat from the sheet or stack to a heat absorbing structure.