Microfluidic Cooling Channels With Nanocoatings for Chiplet Heat Dissipation
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Solution Overview
Problem
Existing cooling technologies for computer components, such as memory and processor chiplets, face challenges in managing thermal management across multiple layers and varying heat densities, with limitations in heat dissipation and transfer efficiency.
Innovation Solution
A cooling system incorporating microfluidic and nanofluidic channels with nanocoatings and nanostructures, utilizing a coolant with additives and metallic nanoparticles, and including pressure, flow, and temperature sensors, to enhance heat dissipation and transfer capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If forced air cooling is used, then device complexity is reduced, but heat dissipation capability is limited to approximately 1 W/mm²
Solution Approach 1:
The patent transitions from forced air cooling to liquid coolant-based microfluidic and nanofluidic cooling systems. The cooling device incorporates channels that allow liquid coolant to flow directly across the interface surface, enabling heat dissipation rates exceeding 1,000 W/cm² through enhanced convective heat transfer mechanisms.
Solution Approach 2:
The patent introduces microfluidic and nanofluidic channels that extend into the interface surface, creating three-dimensional heat transfer pathways. This dimensional transition from surface-level air cooling to subsurface liquid cooling significantly increases the effective heat dissipation area and capability.
2Power
If single-phase liquid coolant is used, then heat dissipation increases to approximately 250 W/cm² to 460 W/cm², but heat transfer efficiency is limited by thermal resistance at the interface
Solution Approach 1:
The patent modifies the physical and chemical parameters of the coolant by incorporating metallic nanoparticles (such as aluminum, copper, or silver) into the liquid coolant formulation. This creates a nanofluid with enhanced thermal conductivity and heat transfer coefficients, directly addressing the thermal resistance limitation at the interface.
Solution Approach 2:
The patent employs composite coolant formulations consisting of base liquid coolant combined with metallic nanoparticles. This composite nanofluid approach combines the flow properties of liquid coolant with the high thermal conductivity of metal particles, achieving superior heat transfer efficiency.
3Power
If cooling channels are integrated at the interface surface, then heat dissipation exceeds 1,000 W/cm², but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides the cooling device into modular components including separate housing, interface surface with integrated channels, and coolant delivery system. This segmentation allows for specialized manufacturing of each component using appropriate techniques while maintaining overall system integration.
Solution Approach 2:
The patent utilizes microfluidic and nanofluidic channel designs that leverage fluid pressure and flow dynamics to achieve effective cooling. The channel geometry and flow rates are optimized to maximize heat dissipation while maintaining manufacturability through standard microfabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high heat dissipation rates exceeding 1,000 W/cm² and heat transfer coefficients over 10,000 W/m²K, effectively managing thermal loads in computer systems.
Implementation Method 1
heat dissipation through the cooling channels
Implementation Method 2
coolant flowing through the cooling channels
Implementation Method 3
The coolant may include metallic nanoparticles such as aluminum, copper, and/or silver
Data Source
AI summary
A cooling system includes a cooling device having a housing defining an interior chamber; an inlet in the housing; an outlet in the housing; and a number of cooling channels at an interface surface of the housing and between the inlet and the outlet. The cooling system may also include a coolant in the interior chamber of the housing, and a nanocoating and/or nanostructures on the cooling channels that are configured to reduce the flow resistance of the coolant flowing in the cooling channels. The cooling channels may be microfluidic channels or nanofluidic channels. The coolant may include an additive and/or metallic nanoparticles.