Microfluidic Nozzle Grouping with Single Drive Signal
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Solution Overview
Problem
Microfluidic systems with multiple nozzles require numerous dedicated electrical connections, leading to complex and costly manufacturing processes due to the need for precise control of each nozzle, resulting in large and expensive devices.
Innovation Solution
A microfluidic delivery system where groups of nozzles are driven by a single drive signal, reducing the number of external and internal electrical connections, and using a printed circuit board with woven fibers to simplify the arrangement and reduce the footprint of the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If each nozzle is controlled by a dedicated electrical connection, then precise control of each nozzle is achieved, but the device becomes large and expensive due to numerous bond pads and internal electrical connections
Solution Approach 1:
Multiple nozzles are grouped together and controlled by a single electrical connection. The die is divided into multiple groups of nozzles, where each group shares a common bond pad and internal electrical connection. This merging of control signals for multiple nozzles reduces the total number of electrical connections required, thereby reducing the die size and manufacturing cost while maintaining adequate control capability.
2Adaptability or versatility
If multiple layers of thin films are added to create CMOS based logic for changing bond pad to nozzle ratio, then the ratio flexibility is improved, but the manufacturing complexity and cost increase significantly
Solution Approach 1:
The die is segmented into multiple groups of nozzles, with each group assigned to a specific bond pad. This segmentation allows for flexible bonding configurations without requiring complex CMOS logic layers. The segmentation approach achieves adaptability through physical grouping rather than electronic reconfiguration, simplifying the manufacturing process.
Solution Approach 2:
The invention uses simple, cost-effective bonding techniques instead of expensive CMOS-based reconfigurable logic. By accepting fixed bonding configurations that are determined during manufacturing, the system avoids the need for complex, multi-layer thin film structures and CMOS logic circuits, significantly reducing manufacturing complexity and cost.
3Device complexity
If groups of nozzles are driven by a single drive signal, then the number of external electrical connections is reduced, but the ability to independently control each nozzle is limited
Solution Approach 1:
The nozzles are divided into multiple independent groups, where each group can be controlled by its own drive signal. This segmentation allows for reduced electrical connections compared to individual nozzle control, while still providing independent control capability at the group level. The segmentation strikes a balance between connection reduction and control flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the electrical connections and reduces the overall size and cost of the microfluidic delivery system while maintaining precise control over fluid ejection from multiple nozzles, allowing for efficient and cost-effective manufacturing.
Implementation Method 1
A heating element positioned below the chamber is coupled to the same single drive signal... the heating element heats the fluid in the chamber to a predetermined temperature
Data Source
AI summary
The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.