Microfluidic Package Structure for Bonding Adhesive Flow Control
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Solution Overview
Problem
Conventional semiconductor packaging technologies face issues with adhesive overflow and insufficient bonding, leading to wiring abnormalities and crack generation due to excessive or insufficient use of bonding adhesives, respectively.
Innovation Solution
A package structure incorporating microfluidic structures with flow channels on a substrate to guide and evenly distribute bonding adhesive, surrounded by a barrier to prevent overflow, ensuring complete bonding and preventing adhesive contamination of conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If excessive bonding adhesive is used, then bonding strength is improved, but adhesive overflow occurs causing wiring abnormalities
Solution Approach 1:
The substrate surface is segmented into multiple flow channels that distribute the bonding adhesive into controlled paths. This segmentation prevents adhesive from concentrating in one area and overflowing, while still providing sufficient adhesive for strong bonding across the die interface.
Solution Approach 2:
The flow channels act as intermediary structures between the adhesive source and the bonding interface. These channels mediate the adhesive flow, guiding it precisely where needed and preventing direct overflow onto surrounding conductive layers.
2Object-generated harmful factors
If insufficient bonding adhesive is used, then adhesive overflow is prevented, but gaps form below die corners allowing encapsulant seepage and crack generation
Solution Approach 1:
Multiple flow channels extend from the center toward all four corners of the substrate, ensuring adhesive is distributed to each corner region. This segmentation prevents gap formation at corners while controlling overall adhesive用量 to prevent overflow.
Solution Approach 2:
The flow channel network provides different adhesive distribution characteristics at different locations. Corner regions receive sufficient adhesive through the extended flow channels to prevent gaps, while the controlled channel paths prevent excessive adhesive in areas where it would cause overflow.
3Ease of manufacture
If bonding adhesive is applied without guidance, then application simplicity is maintained, but adhesive distribution is uneven causing bonding defects
Solution Approach 1:
The flow channels are designed to automatically guide and distribute the bonding adhesive as it is applied. The adhesive self-navigates through the channel network, eliminating the need for complex application mechanisms while achieving uniform distribution. The channels themselves perform the guidance function that would otherwise require sophisticated positioning systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures even adhesive distribution, prevents gaps and cracks, and maintains the integrity of the package structure by blocking adhesive overflow, enhancing the quality and reliability of the semiconductor package.
Implementation Method 1
the at least one flow channel extends from a central portion of the processing surface toward at least one of a plurality of corners of the processing surface. The one or more microfluidic structures are configured to guide the bonding adhesive to contact the one or more microfluidic structures and to flow along the at least one flow channel
Data Source
AI summary
A package structure includes a substrate having a processing surface, one or more microfluidic structures disposed on the processing surface, and a bonding adhesive. Each microfluidic structure includes at least one flow channel, and the at least one flow channel extends from a central portion of the processing surface toward at least one of a plurality of corners of the processing surface. The one or more microfluidic structures are configured to guide the bonding adhesive to contact the one or more microfluidic structures and to flow along the at least one flow channel from an inner position of the processing surface in a plurality of outward directions with respect to the processing surface through guidance of the at least one flow channel. A distribution region of the bonding adhesive after flowing is defined as a bonding region.