Microfluidic Electronic Package Housing for Low Thermal Resistance
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Solution Overview
Problem
The packaging of semiconductor components faces challenges in efficiently dissipating heat generated by high-power density components, leading to thermal resistance issues that affect performance and reliability, particularly in microwave microelectronics.
Innovation Solution
A case with a microfluidic cooling device made of silicon, integrated into the support wall, which includes channels for a heat-transfer fluid to circulate and is designed to maximize contact with the electronic component, reducing thermal resistance through direct heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional packaging with homogeneous materials is used, then manufacturing simplicity is maintained, but thermal dissipation efficiency deteriorates due to thermal resistance at material interfaces
Solution Approach 1:
The packaging structure is segmented into distinct functional zones: a support wall made of electrically insulating material and a cooling device made of thermally conductive material. This segmentation allows each component to optimize its specific function while reducing thermal resistance at the interface between the semiconductor component and cooling structure.
Solution Approach 2:
The cooling device is integrated directly into the support wall structure, merging the mechanical support function with the thermal management function. This integration eliminates intermediate thermal interfaces and creates direct thermal contact between the semiconductor component and the cooling fluid channels, improving thermal dissipation efficiency.
2Temperature
If multiple materials and interfaces are used for cooling, then thermal management capability is improved, but thermal resistance increases due to additional interfaces
Solution Approach 1:
The cooling function is extracted as a separate, dedicated component (cooling device) with internal fluid channels, rather than relying on homogeneous packaging materials. This extraction allows for optimized thermal pathways and direct contact between the semiconductor component and the cooling structure, minimizing thermal resistance.
Solution Approach 2:
A heat-transfer fluid serves as an intermediary medium within the cooling device channels, enabling efficient heat removal from the semiconductor component. The fluid circulates through channels in direct contact with or adjacent to the component, providing a low thermal resistance pathway for heat dissipation.
3Loss of energy
If direct contact cooling is implemented, then thermal contact resistance is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The cooling device channels are pre-formed within the support wall structure during manufacturing, establishing the thermal contact pathways before the semiconductor component is mounted. This preliminary configuration ensures proper alignment and contact between the component and cooling structure, reducing the need for post-assembly adjustments and maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The microfluidic cooling device effectively enhances heat dissipation by minimizing thermal resistance, improving the reliability and performance of semiconductor components by maintaining low thermal contact resistance.
Implementation Method 1
The microfluidic cooling device made of a second material, inserted into the first support wall, for positioning the semiconductor component or components in direct contact with the cooling device through which the heat-transfer fluid travels
Implementation Method 2
the micro-fluidic cooling device including at least one channel for the circulation of a heat-transfer fluid
Implementation Method 3
The discharge of the heat-flow generated by the semiconductor component(s) is improved by means of the contact having a low thermal resistance
Data Source
AI summary
A case for packaging electronic component(s), forming a housing intended to receive at least one electronic component, including a first support wall including an inner face suitable for receiving the electronic component(s), and an outer face, further includes a microfluidic cooling device made of a second material and inserted into the first support wall, the microfluidic cooling device including at least one channel for circulation of a heat-transfer fluid connected to a first inlet port for the heat-transfer fluid and to a second outlet port for the heat-transfer fluid, the cooling device including at least one platform for receiving the electronic component(s) in contact with the at least one channel for the circulation of a heat-transfer fluid.