Microfluidic Component Packaging for PCB-Ready Multi-Function Integration
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Solution Overview
Problem
Conventional microfluidic production methods struggle to integrate mechanical, optical, and electrical functions with fluidic functions in a single device, leading to complex and costly manufacturing processes that are not suitable for large-scale production, and lack a consistent method for embedding components within microfluidic systems.
Innovation Solution
A microfluidic component package (MFCP) that allows for the embedding of microfluidic devices within a larger system, comprising a molded polymer enclosure with access ports for fluid interaction and electrical, optical, and mechanical connections, enabling consistent integration with printed circuit boards and other substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If microfluidic functions are integrated with mechanical, optical, and electrical functions in a single device, then system functionality is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent divides the microfluidic system into separate functional modules (microfluidic channels, electronic components, optical components, mechanical components) that are manufactured independently and then integrated through standardized packaging. This segmentation allows each component to be optimized separately while maintaining overall system functionality, resolving the contradiction between versatility and complexity.
Solution Approach 2:
The patent creates a universal packaging structure that can accommodate multiple types of components (electronic, optical, mechanical, microfluidic) through standardized interfaces and mounting mechanisms. This universal package design enables integration of diverse functions without proportionally increasing device complexity, as the same packaging framework serves multiple component types.
2Ease of manufacture
If non-fluidic functions are added as external components after microfluidics production, then manufacturing simplicity is improved, but system integration and consistency deteriorate
Solution Approach 1:
The patent merges the microfluidic components with electronic, optical, and mechanical components into a single integrated package assembly. This combining approach maintains manufacturing simplicity by allowing separate component production while achieving reliable system integration through unified packaging and standardized interconnections, thus resolving the contradiction between ease of manufacture and system integration.
3Adaptability or versatility
If attempts are made to include all functions during microfluidic channel manufacture, then integration is improved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-assembling and testing individual functional modules (electronic subassemblies, optical subassemblies, mechanical subassemblies) before final integration with the microfluidic channels. This preliminary preparation of components allows for standardized interfaces and simplified final assembly, achieving good integration without significantly increasing manufacturing process complexity.
4Reliability
If discrete components are embedded within microfluidic system, then component quality is improved, but embedding consistency and manufacturability deteriorate
Solution Approach 1:
The patent introduces an intermediary packaging structure that serves as a standardized interface between discrete high-quality components and the microfluidic system. This package acts as a mediator, providing consistent mechanical, electrical, and fluidic connections while allowing discrete components to be manufactured separately with high quality standards, thus resolving the contradiction between component quality and embedding consistency.
Data Source
AI summary
A microfluidic component package that is readily integratable within a microfluidic system.