Embedded Microfluidic PCB Cooling for High-Power Thermal Dissipation
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Solution Overview
Problem
Existing printed circuit boards (PCBs) face thermal management challenges due to high-power components generating substantial thermal energy, necessitating external thermal management add-ons like heat sinks, which are costly and inefficient.
Innovation Solution
Integration of microfluidic cooling systems within PCBs, where microfluidic passages are embedded in the board layers, thermally connected to heat-generating components, and isolated electrically, with a pump to circulate coolant for effective thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external thermal management add-ons like heat sinks are used, then thermal energy can be dissipated, but cost increases and efficiency decreases
Solution Approach 1:
The patent combines the thermal management function with the PCB structure itself by integrating microfluidic passages directly into the PCB layers. This merging eliminates the need for separate external heat sinks and thermal management components, thereby reducing device complexity while maintaining effective heat dissipation.
Solution Approach 2:
The patent introduces a coolant fluid as an intermediary medium that flows through the microfluidic passages to transfer thermal energy away from heat-generating components. This intermediary approach enables efficient heat removal without requiring direct thermal contact with external heat sinks, reducing both complexity and cost.
2Temperature
If microfluidic passages are integrated within PCB layers, then thermal management efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The PCB structure is designed to serve multiple functions simultaneously: electrical signal transmission through conductive traces and thermal management through integrated microfluidic passages. This multi-functionality allows the same substrate to handle both electrical and thermal tasks, avoiding the need for separate manufacturing processes for thermal management components.
Solution Approach 2:
The patent utilizes the vertical dimension within PCB layers to route microfluidic passages, allowing coolant flow paths to be embedded within the layered structure without interfering with planar electrical traces. This dimensional approach enables thermal management integration without significantly complicating the manufacturing process.
3Temperature
If microfluidic passages are in thermally conductive contact with heat-generating components, then cooling effectiveness increases, but electrical isolation becomes more difficult
Solution Approach 1:
The patent segments the PCB into distinct functional layers: conductive layers for electrical signals and non-conductive layers for microfluidic passages. This segmentation allows thermal contact between coolant and heat-generating components while maintaining electrical isolation through the non-conductive substrate material.
Solution Approach 2:
The non-conductive substrate material acts as an intermediary that enables thermal conduction from heat-generating components to the coolant while simultaneously providing electrical isolation. This intermediary property resolves the contradiction between achieving thermal contact and maintaining electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the need for external thermal management solutions, provides adaptive thermal management, and is more economical than component-specific cooling, effectively dissipating heat while maintaining electrical isolation.
Implementation Method 1
The network of microfluidic passages is applied to one or more of the ground layer, the power layer, and the signal layer and in thermally conductive contact with the heat-generating component
Implementation Method 2
A microfluidic pump is connected in line with the network of microfluidic passages. The microfluidic pump flows a coolant fluid through the network of microfluidic passages to cool the heat-generating component
Data Source
AI summary
Printed circuit boards (PCBs) are a fundamental component used in nearly all electronics. PCBs provide electrical connections and mechanical support to electronic components and are generally made of copper layers laminated onto, through, and/or between one or more non-conductive substrate layers. The presently disclosed technology is directed to microfluidic cooling systems for PCBs. Such systems may be used to alleviate thermal issues caused by continuous operation of high-power components on PCB boards with high-current density signals and fast switching power supplies, for example, all of which generate substantial quantities of thermal energy to dissipate. A microfluidic pump is connected in line with the network of microfluidic passages. The microfluidic pump flows a coolant fluid through the network of microfluidic passages to cool heat-generating components on the PCB.