Microfluidic Photonics Architecture With Integrated Power and Cooling
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Solution Overview
Problem
Conventional processing units face challenges in efficiently delivering power and managing heat due to limited space in dense server configurations and datacenters, where traditional power supplies and cooling systems are inefficient and unable to cool all dies in multi-die processors effectively.
Innovation Solution
The integration of an electrochemical fluid in a microfluidic volume within a substrate, which generates electrical power and manages heat through ion transfer across an ion-transfer membrane, providing power to processors via through-silicon vias and exhausting heat, allowing for local and efficient power delivery and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional power supplies and cooling systems are used in dense server configurations, then processor density can be increased, but available space for power delivery and heat removal decreases
Solution Approach 1:
The patent combines power delivery and thermal management functions into a single integrated system. The electrochemical fluid serves dual purposes: it acts as an electrolyte for power generation through ion transfer across membranes, and simultaneously functions as a cooling medium by absorbing heat from processors through microfluidic channels. This merging eliminates the need for separate power supplies and cooling systems, thereby maximizing space utilization in dense server configurations.
Solution Approach 2:
The electrochemical fluid system performs multiple functions simultaneously: it generates electrical power through electrochemical reactions, removes heat from processors through convection, and can be circulated through microfluidic pathways. This multi-functionality allows a single system to replace traditional discrete power supplies and cooling infrastructure, addressing the space constraint while maintaining high processor density.
2Reliability
If discrete power supplies and cooling systems are used, then power delivery and heat removal can be achieved, but space efficiency decreases in dense configurations
Solution Approach 1:
The patent merges previously discrete power delivery and thermal management systems into a single integrated electrochemical fluid system. The fluid circulates through microfluidic channels that are embedded within or adjacent to processor packages, allowing simultaneous power generation and heat removal in close proximity to the heat sources, thereby maintaining reliability while reducing overall system complexity.
Solution Approach 2:
The electrochemical fluid acts as an intermediary medium that bridges power generation and thermal management functions. It transfers energy through electrochemical reactions for power delivery and absorbs thermal energy through convection for cooling, serving as a unified intermediary that simplifies the system architecture compared to discrete components.
3Temperature
If traditional thermal interfaces are used, then heat can be removed from processors, but processor density is limited by the space required for these interfaces
Solution Approach 1:
The patent employs a liquid-based microfluidic cooling system where electrochemical fluid circulates through channels in close contact with processor surfaces. This hydraulic approach allows efficient heat transfer through the fluid medium, replacing traditional solid thermal interfaces with a flexible liquid cooling system that can be integrated at higher densities.
Solution Approach 2:
The microfluidic channels are positioned in three-dimensional proximity to processor surfaces, potentially within the substrate or on adjacent layers. This spatial arrangement in multiple dimensions allows heat removal without requiring additional horizontal space, thereby enabling higher processor density while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables increased processor density by eliminating the need for traditional power delivery methods and thermal interfaces, providing efficient power and thermal management directly to processors, thus enhancing the performance and reliability of computing devices.
Implementation Method 1
generates electrical power and manages heat through ion transfer across an ion-transfer membrane
Implementation Method 2
a working fluid in the microfluidic volume to receive heat from the waveguide
Implementation Method 3
a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver
Data Source
AI summary
An electronic device includes a substrate having a first surface and an opposite second surface; a photonic transmitter supported by the first surface of the substrate; a photonic receiver supported by the first surface of the substrate; a microfluidic volume positioned in the second surface of the substrate; a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and a working fluid in the microfluidic volume to receive heat from the waveguide.