Microfluidic Substrate Ultrasonic Droplet Splitting
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Solution Overview
Problem
Existing microfluidic systems require excessively high voltages for droplet splitting, exceeding 100 volts, which poses challenges for high-voltage-resistance performance and complicates the manufacturing process due to the need for high-voltage switching devices that often cannot withstand such voltages.
Innovation Solution
Incorporating an ultrasonic structure with a piezoelectric material layer and electrode layers to generate directional ultrasonic waves, reducing the surface energy of the droplet and facilitating splitting without excessive voltage, while using oxide thin film transistors for control and detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional voltage-based droplet splitting is used, then droplet splitting can be achieved, but excessively high voltages (>100V) are required, posing challenges for high-voltage-resistance performance and complicating manufacturing
Solution Approach 1:
The patent replaces the conventional voltage-based electrostatic droplet splitting method with an ultrasonic wave-based mechanical vibration method. The ultrasonic structure generates ultrasonic waves that directly vibrate the droplet to induce splitting, eliminating the need for high-voltage electrodes and high-voltage-resistance materials, thus simplifying the manufacturing process while maintaining reliable droplet manipulation
Solution Approach 2:
The patent changes the physical parameter used for droplet splitting from electrical voltage to ultrasonic frequency. By applying ultrasonic waves at specific frequencies (typically 20-100 kHz), the droplet experiences mechanical vibration that reduces surface tension and promotes splitting, avoiding the high-voltage requirement entirely
2Ease of operation
If high-voltage switching devices are used for droplet splitting, then droplet manipulation is achieved, but the devices cannot withstand the required voltages and the manufacturing process is complicated
Solution Approach 1:
The patent replaces high-voltage switching devices with ultrasonic wave generation devices. The ultrasonic structure (such as a piezoelectric transducer or surface acoustic wave device) generates mechanical vibrations at ultrasonic frequencies, which directly manipulate the droplet through vibration-induced surface tension reduction, eliminating the need for high-voltage switching components
Solution Approach 2:
The patent introduces ultrasonic waves as an intermediary between the control system and the droplet. Instead of directly applying high voltage to the droplet, the system uses ultrasonic waves as a mediator to transfer energy to the droplet, causing it to vibrate and split. This intermediary approach enables gentle and precise droplet manipulation without high-voltage damage
3Productivity
If excessive voltage is applied for droplet splitting, then droplet splitting can be achieved, but energy consumption increases
Solution Approach 1:
The patent changes the energy input parameter from high voltage to ultrasonic frequency. By applying ultrasonic waves at resonant frequencies of the droplet, the system achieves efficient energy transfer that amplifies the splitting effect at low power consumption, rather than requiring continuous high-voltage application
Solution Approach 2:
The patent uses periodic ultrasonic wave application to achieve droplet splitting. The ultrasonic waves oscillate at high frequency (20-100 kHz), creating periodic stress cycles in the droplet that progressively reduce surface tension and promote splitting. This periodic action is more energy-efficient than continuous high-voltage application because it exploits the natural oscillation and relaxation cycles of the droplet
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ultrasonic structure reduces the voltage required for droplet splitting, saves energy consumption, and simplifies the manufacturing process by eliminating the need for high-voltage-resistant switching devices, enabling efficient and controlled droplet manipulation.
Implementation Method 1
the material layer is configured to generate the ultrasonic waves when a first voltage is applied to the first electrode layer
Implementation Method 2
The ultrasonic structure is configured to generate ultrasonic waves during a splitting process of a droplet to vibrate the droplet
Data Source
AI summary
The present disclosure provides a microfluidic substrate, a microfluidic chip and a micro total analysis system. The microfluidic substrate includes a substrate and an ultrasonic structure on the substrate. The ultrasonic structure is configured to generate ultrasonic waves during a droplet splitting process to vibrate a droplet.